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Exposure system and method for reducing three-dimensional effect of mask plate in exposure process

A three-dimensional effect and exposure system technology, applied in the field of semiconductor manufacturing, can solve the problems of large gap in the best focal plane and narrowing of the photoresist process window, etc., to reduce spherical aberration, improve the best depth of field, and improve the process window Effect

Active Publication Date: 2020-09-18
淮安西德工业设计有限公司
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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an exposure system and a method for reducing the three-dimensional effect of the mask in the exposure process, which is used to solve the problems caused by the three-dimensional effect of the mask in the prior art. The optimal focal plane of graphics in different areas has a large gap, and the photoresist process window narrows, etc.

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  • Exposure system and method for reducing three-dimensional effect of mask plate in exposure process
  • Exposure system and method for reducing three-dimensional effect of mask plate in exposure process
  • Exposure system and method for reducing three-dimensional effect of mask plate in exposure process

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Embodiment Construction

[0041] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0042] see Figure 1 to Figure 10 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, although only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the shape, quantity and proportion of each component can be changed arbitrarily during actual implementation, and ...

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Abstract

The invention provides an exposure system and a method for reducing the three-dimensional effect of a mask plate in the exposure process. The method comprises the following steps: a substrate to be processed is provided; a layer to be exposed is formed on the substrate; a lens unit and a mask plate unit with a transfer pattern are mounted, wherein an adjustment distance is formed between the lensunit and the mask plate unit; A data analog processing apparatus is provided, and based on it, so as to reduce the phase difference caused by the three-dimensional effect of the mask plate unit, to reduce spherical aberration. by adjusting the height of the mask, the distance between the mask plate and the lens is adjusted, the phase difference due to the 3D effect of the mask plate is reduced, Asthat aberration of the spherical surface is reduce, the optimum depth of field is improved, the proces window of the photoresist is improved, and the problem that the height of the lens is difficultto be adjusted is sol, the height of the mask plate is adjusted to make the optimum focal plane of the patterns of different regions on the mask plate close to each other, the common depth of field range of the different patterns is wider, and the process window of the photoresist is widened.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to an exposure system and a method for reducing the three-dimensional effect of a mask plate in the exposure process. Background technique [0002] Devices such as semiconductor elements, liquid crystal display elements, and packaging substrates manufactured using projection exposure equipment often have a multilayer structure, and transfer patterns are superimposed on substrates such as wafers. Exposure is performed by arranging the same pattern at a predetermined pitch on the substrate, but in order to increase throughput, it is also possible to arrange multiple identical patterns on the photomask, and simultaneously transfer to multiple projection areas with a single projection (one exposure). print. [0003] At present, the light-shielding layer on the mask plate and the quartz glass substrate constitute the three-dimensional structure of the mask plate. Ge...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70283G03F7/705G03F7/70516
Inventor 龙海凤李天慧藤井光一
Owner 淮安西德工业设计有限公司