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A multi-station workpiece stage one-time exposure molding direct-writing lithography system

A lithography system and multi-station technology, which is applied in the field of multi-station workpiece table one-time exposure molding direct-write lithography system, can solve the problems of lower exposure quality and yield, unstable optical path system, and lower work efficiency, etc., to achieve Improve the best production capacity, exposure quality and yield, shorten exposure time, and improve work efficiency

Inactive Publication Date: 2019-01-18
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing problems of reducing work efficiency and failing to reach the best production capacity caused by frequent left and right reciprocating movement of the existing optical path system, and easily leading to the instability of the optical path system and reducing the exposure quality and yield, etc., the present invention provides a A direct-write lithography system for multi-station workpiece stage with one exposure forming

Method used

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  • A multi-station workpiece stage one-time exposure molding direct-writing lithography system
  • A multi-station workpiece stage one-time exposure molding direct-writing lithography system
  • A multi-station workpiece stage one-time exposure molding direct-writing lithography system

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Embodiment 1

[0025] This embodiment provides a multi-station workpiece stage direct-write lithography machine for one-time exposure molding. The lithography machine includes a multi-station workpiece stage direct-write lithography system, and the system includes double tables and a fixed combined optical path system. ; For the convenience of description, the double tables are called A workbench and B workbench respectively; the A workbench can realize the movement in the X direction, the Y direction and the Z direction, and the B workbench can realize the movement in the Y direction and the Z direction. Moving in the Z direction, the combined optical path system is located on the supporting structure.

[0026] The movable range of the A table in the Z direction is smaller than the movable range of the B table in the Z direction.

[0027] The two rows of optical path units of the combined optical path system are arranged in a cross pattern; including multiple combinations, figure 2 Severa...

Embodiment 2

[0034] This embodiment provides a one-time exposure forming direct-writing lithography method, using the multi-station workpiece table provided in Embodiment 1 one-time exposure forming direct-writing lithography machine, the method includes single-station implementation and multi-station implementation Two implementation methods, the following two possible implementation methods are listed below, and they are introduced separately below:

Embodiment approach 1

[0035] Embodiment 1. In this embodiment, the initial positional relationship between workbench A and workbench B is an up-and-down position relationship, and there is a drop between the two in the Z direction, which can be realized by a single station. Please refer to image 3 as shown in 1;

[0036] The methods include:

[0037] (1) A workpiece table 7 starts loading after the previous piece of material is unloaded; put the substrate to be exposed on the A workpiece table 7, such as image 3 as shown in 1;

[0038] (2) The A workpiece table is aligned in the Y direction, and the B workpiece table moves up in the Z direction. After the last piece of material is unloaded, start loading, such as image 3 As shown in middle 2; in this step, during the alignment system 10 aligning the A workpiece table, it may be necessary to move the lifting platform in a small range in the Z direction due to the difference in the thickness of the substrate to be exposed, usually the moving ran...

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Abstract

The invention discloses a multi-station workpiece stage one-time exposure molding direct-writing lithography system, and belongs to the technical field of direct-writing lithography machine rapid scanning exposure. Two mesas are no longer stepped in the process of exposure, while one mesa is in the process of one exposure molding, the other mesa is in the process of upper and lower plates, alignment and other operation processes, which greatly shortens the exposure time and has a significant increase compared with the current mainstream direct-writing exposure machine. As that optical path system does not move left and right frequently, the problems that the work efficiency is reduced due to the frequent left and right reciprocating movement of the optical path system, the optimal production capacity is not reach, and the exposure quality and the yield are reduced due to the instability of the optical path system, etc. are avoided. The effect of improving work efficiency and productivity, exposure quality and yield is achieved.

Description

technical field [0001] The invention relates to a multi-station workpiece platform one-time exposure forming direct-writing photolithography system, which belongs to the technical field of rapid scanning exposure of direct-writing photolithography machines. Background technique [0002] Direct-write lithography technology is a direct image transfer technology that has developed rapidly in recent years and replaces traditional mask-type lithography technology. It has an increasingly important position in the field of semiconductor and PCB production. Compared with the traditional mask plate photolithography technology, the direct write photolithography technology can shorten the process flow and reduce the manufacturing cost. [0003] At present, there are two main types of mainstream multi-workpiece direct-write lithography machines on the market: one is designed in a vertical manner, that is, two worktables are in an upper and lower structure. Due to the thickness of the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/2051G03F7/70383G03F7/70716
Inventor 赵彦青陈海巍刘世林魏东红
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD