Camera module and camera device

Abstract

The present invention improves the resolution of space, time, and energy in imaging devices such as optical mapping devices and optical CT devices, and greatly improves the accuracy of image diagnosis by reducing the size and weight of imaging devices, thereby realizing early detection of diseases and medical expenses. reduction. The present invention provides an imaging device of an imaging module. The imaging module is a semiconductor imaging element that uses the side surface of the semiconductor substrate in the direction perpendicular to the surface of the semiconductor substrate on which the integrated circuit is formed as a light-receiving surface. On the substrate surface, one or more light source sections are arranged such that the light emitting direction from the light source section coincides with the normal direction of the side surface of the substrate.

Description

technical field [0001] The present invention relates to an imaging module that is excellent in energy, space, and time resolution, and realizes high sensitivity, small size, light weight, and low power consumption, and an imaging device using the imaging module. Background technique [0002] Conventionally, an optical CT (computed tomography) apparatus using near-infrared light is disclosed (Patent Document 1). However, since it is necessary to arrange a plurality of detectors radially or to rotate the light source around the subject, sufficient spatial resolution cannot be obtained, and it is difficult to reduce the size and weight of the device. Similarly, a mammography apparatus using near-infrared light is also disclosed (Patent Document 2), but since there are restrictions on the arrangement of detectors and light sources conforming to the shape of the subject and the number of detectors is also limited, It is difficult to find small lesions in the early stage or withi...

AI Technical Summary

Problems solved by technology

Therefore, the peripheral portion or the side wall portion of the surface of the imaging element is mechanically damaged or thermally damaged by the dicing process, resulting in crystal defects, and is exposed to contamination from external heavy metals, reactive chemical substances, etc.

Therefore, there are still unresolved technical problems in the imaging element that uses the side surface of the substrate as the light receiving part like this.

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