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Fiber composite material for robotic electronic skin and preparation method thereof

A fiber composite material and electronic skin technology, which is applied in fiber type, fiber treatment, hollow filament manufacturing, etc., can solve the problems of low sensitivity, poor mechanical properties of pure liquid metal, weak tensile properties and electrical conductivity, etc. problems, to achieve the effect of excellent conductivity, broad application prospects, and good stretchability

Inactive Publication Date: 2019-02-15
CHENDU NEW KELI CHEM SCI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] It can be seen that the sensitivity of the flexible sensor used for electronic skin in the prior art is low, while the use of liquid metal can improve the sensitivity, but due to the poor mechanical properties of pure liquid metal, the tensile properties of the composite material used for electronic skin are not good. Therefore, the tensile properties and electrical conductivity of commonly used electronic skin materials are not strong, which has become an important problem restricting the development of electronic skin.

Method used

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  • Fiber composite material for robotic electronic skin and preparation method thereof

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Embodiment 1

[0029] a. Add pyromellitic dianhydride and 4,4'-diphenyl ether diamine into N-methylpyrrolidone, and obtain polyamic acid solution through polycondensation reaction. The temperature of polycondensation reaction is 8°C, and the time is 4h. Wet spinning and thermal stretching, the temperature of thermal stretching is 290°C, and the stretching ratio is 2 times; hollow polyimide fibers are obtained; wherein, 12 parts by weight of pyromellitic dianhydride, 4,4' - 18 parts by weight of diphenyl ether diamine, 70 parts by weight of N-methylpyrrolidone;

[0030] b. Rinse the hollow polyimide fiber prepared in step a, and slowly immerse it in the tin-gallium liquid metal, in the tin-gallium liquid metal, 45 parts by weight of tin and 55 parts by weight of gallium; take it out after standing at 70°C for 25 minutes, And repeat the immersion and removal, the number of repetitions is 4 times; the tin-gallium liquid metal is filled with the hollow polyimide fiber;

[0031] c. Place the hol...

Embodiment 2

[0033] a. Add pyromellitic dianhydride and 4,4'-diphenyl ether diamine into N-methylpyrrolidone, and obtain polyamic acid solution through polycondensation reaction. The temperature of polycondensation reaction is 8°C, and the time is 3.5h. After wet spinning and thermal stretching, the temperature of thermal stretching is 295°C, and the draw ratio is 3 times; hollow polyimide fibers are obtained; wherein, 14 parts by weight of pyromellitic dianhydride, 4,4 19 parts by weight of '-diphenyl ether diamine, 67 parts by weight of N-methylpyrrolidone;

[0034] b. Rinse the hollow polyimide fiber prepared in step a, and slowly immerse it in the tin-gallium liquid metal, in the tin-gallium liquid metal, 50 parts by weight of tin and 50 parts by weight of gallium; take it out after standing at 80° C. for 27 minutes, And repeat the immersion and removal, the number of repetitions is 5 times; make the tin-gallium liquid metal fill the hollow polyimide fiber;

[0035] c. Place the hollo...

Embodiment 3

[0037] a. Add pyromellitic dianhydride and 4,4'-diphenyl ether diamine into N-methylpyrrolidone, and obtain polyamic acid solution through polycondensation reaction. The temperature of polycondensation reaction is 10°C, and the time is 3h. Wet spinning and thermal stretching, the temperature of thermal stretching is 300°C, and the stretching ratio is 3 times; hollow polyimide fibers are obtained; wherein, 15 parts by weight of pyromellitic dianhydride, 4,4' - 20 parts by weight of diphenyl ether diamine, 65 parts by weight of N-methylpyrrolidone;

[0038] b. Rinse the hollow polyimide fiber prepared in step a, and slowly immerse it in the tin-gallium liquid metal, in the tin-gallium liquid metal, 60 parts by weight of tin and 40 parts by weight of gallium; take it out after standing at 80° C. for 30 minutes, And repeat the immersion and removal, the number of repetitions is 5 times; make the tin-gallium liquid metal fill the hollow polyimide fiber;

[0039]c. Place the hollow...

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Abstract

The invention discloses a fiber composite material for robotic electronic skin and a preparation method thereof. The fiber composite material is prepared according to the following steps: a, adding pyromellitic dianhydride and 4,4'-diphenyl ether diamine into N-methylpyrrolidone, performing a polycondensation reaction, and then performing wet spinning and hot stretching to obtain hollow polyimidefiber; b, filling the hollow polyimide fiber with tin-gallium liquid metal; c, curing the tin-gallium liquid metal in a room-temperature environment to obtain the fiber composite material for the electronic skin. The preparation method has the beneficial effects as follows: the hollow fiber material is used and filled with the liquid metal, and the tin-gallium liquid metal has excellent electricalconductivity as well as good stretchability in a solid state, the obtained fiber composite material has high stretchability and high electrical conductivity and has a broad application prospect in the fields of flexible wearable devices, the flexible electronic skin, intelligent robots and the like.

Description

technical field [0001] The invention relates to the field of electronic skin, in particular to the preparation of composite fibers, in particular to a fiber composite material and a preparation method for robot electronic skin. Background technique [0002] Electronic skin is a wearable electronic device that can simulate the mechanical properties and sensory capabilities of the skin. Touch is an important sensory function when people are in direct contact with the external environment. Flexible tactile sensors are the key technology to realize electronic skin technology. Its purpose is to simulate human perception ability and has excellent development prospects. At present, with the development of microelectronics technology and the emergence of various organic materials, a variety of flexible tactile sensor development schemes have been proposed, but most of them belong to the laboratory stage, and few have reached commercialization. Therefore, the research and applicatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D06M11/83D01F6/74D01F1/08C08G73/10D06M101/30
CPCD06M11/83C08G73/1007C08G73/1071D01F1/08D01F6/74D06M2101/30
Inventor 陈庆司文彬
Owner CHENDU NEW KELI CHEM SCI CO LTD
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