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PCB manufacturing method and PCB

A manufacturing method and motherboard technology, applied in the direction of printed circuit manufacturing, electrical connection formation of printed components, electrical components, etc., to achieve the effects of reducing risks, reducing positional misalignment, and good reliability

Inactive Publication Date: 2019-02-15
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current industry, dense design will bring reliability risks. How to make PCB not only meet the requirements of dense design, but also ensure good reliability, and make it convenient is the difficulty and focus of current research

Method used

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  • PCB manufacturing method and PCB
  • PCB manufacturing method and PCB
  • PCB manufacturing method and PCB

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Embodiment Construction

[0017] In order to explain in detail the technical solutions adopted by the present invention to achieve the intended technical purpose, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only part of the embodiments of the present invention, rather than all embodiments, and, on the premise of not paying creative work, the technical means or technical features in the embodiments of the present invention can be replaced, the following will refer to the accompanying drawings and combine Examples illustrate the present invention in detail.

[0018] figure 1 , figure 2 As shown, the present invention provides a PCB manufacturing method, especially regarding the method of double-sided pressing and back drilling of PCBs, which is realized by a brand-new process route. The spec...

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Abstract

The invention provides a PCB manufacturing method and a PCB. The PCB manufacturing method comprises the following steps: 1) a plurality of core plates are provided, corresponding line pattern manufacturing is carried out on the core plates, and a mother board is obtained through pressing and synthesizing; 2) a back drilling blind hole is formed in the surface of the mother board; 3) an auxiliary through hole is drilled axial to the back drilling blind hole, and the auxiliary through hole penetrates through the two surfaces of the mother board, wherein the hole diameter d of the auxiliary through hole is smaller than the hole diameter D1 of the back drilling blind hole; 4) copper deposition electroplating is carried out on the mother board after completing the drilling; and 5) back drillinghole processing is carried out on the auxiliary through hole on the other surface, opposite to the back drilling blind hole, of the mother board, wherein the back drilling hole and the auxiliary through hole are coaxial, and it is ensured that the hole diameter d of the auxiliary through hole is smaller than the hole diameter D2 of the back drilling hole, and the number of core plates, the back drilling blind hole and the back drilling hole of which are overlapped, is less than or equal to 5. According to the method provided by the invention, the position dislocation of the pressing connection hole and the back drilling hole can be reduced to the maximum extent by virtue of the two-sided opposite-pressing back drilling hole method.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board (PCB), in particular to a method for drilling processing holes on a double-sided pressure back on a PCB. Background technique [0002] The design of crimping holes and back-drilling holes is the most common in PCB technology. With the gradual development of electronic products to miniaturization and multi-function, higher requirements are put forward for the design and production process of PCB crimping holes and back-drilling holes. Dense arrangement requirements and reliability requirements. In the current industry, dense design will bring reliability risks. How to make PCB not only meet the requirements of dense design, but also ensure good reliability, and make it convenient is the difficulty and focus of current research. Contents of the invention [0003] In view of the above, it is necessary for the present invention to provide a PCB manufacturing method that satisfie...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/42
Inventor 傅宝林刘梦茹杜红兵纪成光陈正清
Owner DONGGUAN SHENGYI ELECTRONICS
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