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Resin adhesive tape casting film forming method

A technology of cast film forming and resin glue, which is applied in the field of epoxy resin film production technology, can solve the problems that the resin film is easy to have pores and difficult to operate, and achieve the effect of reducing the generation of air bubbles

Active Publication Date: 2019-02-19
SHENZHEN MICROGATE TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In summary, the purpose of the present invention is to solve the technical problems that existing epoxy resin-based adhesives are difficult to operate when making epoxy resin films, and the formed resin films tend to have pores. Membrane method

Method used

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  • Resin adhesive tape casting film forming method

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Embodiment Construction

[0018] The process method of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0019] refer to figure 1 Shown in, the method for cast resin film of the present invention comprises the following steps:

[0020] 1), choose the coefficient of thermal expansion as 20-80 (10 -6 / °C) epoxy resin-based adhesives are used as raw materials and stored in a temperature environment below -40°C for later use; it is preferable to freeze the epoxy resin-based adhesives in the refrigerator to -55°C.

[0021] 2) Take out the epoxy resin-based adhesive and place it in a normal temperature environment to thaw to a normal flowable state. The thawing time should not exceed 2 hours; preferably, the epoxy resin-based adhesive will start to flow after being taken out of the refrigerator and returned to the temperature for 1 hour. Delay, return to temperature for 1 hour and the resin glue will thaw to a normal flowable sta...

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Abstract

The invention discloses a resin adhesive tape casting film forming method, and relates to the technical field of epoxy resin film production processes for chip packaging. The method solves the problemthat an existing epoxy resin-based adhesive is high in operation difficulty when an epoxy resin film is manufactured, and an air hole is easily formed in the formed resin film. The method comprises the following steps of 1), selecting the epoxy resin-based adhesive with the coefficient of thermal expansion being 20-80 (10 < -6 > / DEG C) as raw mateiral, and storing the raw material in a temperature environment of -40 DEG C or below for later use; 2), taking out the epoxy resin-based adhesive, and unfreezing the epoxy resin-based adhesive in a normal-temperature environment until the epoxy resin-based adhesive returns to a normal flow state; 3 ) guiding the epoxy resin-based adhesive into a knife edge of a tape casting machine from one direction to prevent too much air from being brought into the raw material, and discharging excess air after the epoxy resin-based adhesive fully fills the knife edge and placed to stand, wherein the length of the standing time is proper when the epoxy resin-based adhesive does not flow out of the knife edge. Redundant air is discharged, the generation of bubbles in the casting process is reduced, and the resin film with the uniform thickness is prepared.

Description

technical field [0001] The invention relates to the technical field of epoxy resin film production technology for chip packaging. Background technique [0002] Electronic packaging is an important means to protect devices from environmental influences and to work reliably for a long time. It directly affects device performance and production costs, and plays a key role in system miniaturization. In the packaging process, it is usually required that the temperature of the chip should not exceed the allowable value, there should be no metal chips in the shell, no harmful gas or impurities should be released, the packaging should be carried out in a clean and low-humidity environment, and the packaging should have good airtightness . Due to the advantages of low cost, small size, light weight, and mass production, plastic-encapsulated devices have accounted for more than 90% of the domestic microelectronics market. The material used is thermosetting, which means that it soften...

Claims

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Application Information

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IPC IPC(8): B29C41/00B29C41/24B29C41/46B29L7/00B29K63/00
CPCB29C41/003B29C41/24B29C41/46B29K2063/00B29L2007/002
Inventor 姚艳龙赖定权罗延杰
Owner SHENZHEN MICROGATE TECH
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