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Black printing ink, and preparation method and application thereof

A technology of black ink and carbon black, which is applied in the field of flexible circuit boards, can solve the problems of immature production technology, difficult production, and high difficulty, and achieve the effects of wide sources of production raw materials, avoiding short circuits between lines, and avoiding pollution

Active Publication Date: 2019-02-22
ZHONGSHAN DONGYI HIGH TECH MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the problem with the first approach is that black PI films with a thickness of more than 25 μm are sold both at home and abroad, while black PI films with a thickness of 12.5 μm are less produced and supplied, and the price is expensive and the production process is immature. In order to achieve the required blackness, a large amount of carbon black powder must be added to the black PI film, which will lead to a decrease in the surface insulation performance, short circuit and other undesirable phenomena, so the blackness and insulation performance are contradictory, and the filler ratio will be too high. Seriously affect the actual PI film production, so many manufacturers can produce black PI, but it is difficult to produce the thickness of 12.5μm, and customers often demand exactly this specification
[0005] The problem with the second way to start from the glue formula is that the cover film itself has very complicated requirements for the glue layer, and multiple properties are contradictory. It is extremely difficult to obtain a cover film that meets the requirements. This kind of black glue will make the contradiction more complicated, not only to solve the problem of the covering film itself, but also to reconcile the contradiction between blackness, light transmittance and insulation caused by adding carbon black. It is inevitable that the final black The basic performance of the cover film is worse than that of the ordinary cover film, including storage, adhesion, shape, electrical properties, etc. will be reduced to varying degrees, and its matteness (rough surface, which is an appearance property) and other properties are difficult to achieve. Requirements of mobile phone manufacturers

Method used

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  • Black printing ink, and preparation method and application thereof
  • Black printing ink, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] This example has prepared a kind of black ink, and number is A, and component and preparation method are:

[0049] Add ODA, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, two diamines; and BPADA, BTDA anhydride into the NMP solvent according to the molar ratio of anhydride:diamine of 1:1 , wherein the solid content is 20%, fully mixed and stirred in a water bath at 5°C for 8 hours to obtain PAA acid;

[0050] Add acetic anhydride and pyridine to the PAA acid synthesized in the first step at a molar ratio of 2:1:1 to acid anhydride and dehydrate at 90°C for 7 hours to obtain soluble polyimide 1.

[0051] Add the above 32g soluble polyimide 1 solution, 3.84g Clariant OP-935, 7.72g Nagase XD-1000 resin, 8g DMAC solvent, 4.5g Mitsubishi MA-100, 0.6g talcum powder in order, Stir at high speed for 2 hr to obtain black ink A.

Embodiment 2

[0053] This example has prepared a kind of black ink, and number is B, and component and preparation method are:

[0054] Add 3,3'-DDS, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, two diamines; and BPADA, PMDA anhydride into NMP solvent in a molar ratio of 1:1 , wherein the solid content is 10%, fully mixed and stirred in a water bath at 5°C for 8 hours to obtain PAA acid;

[0055] Add acetic anhydride and isoquinoline to the PAA acid synthesized in the first step at a molar ratio of 2:1:1 to acid anhydride and dehydrate at 90°C for 7 hours to obtain soluble polyimide 2.

[0056]Add the above 30g soluble polyimide 2 solution, 3.2g Clariant OP-935, 7.72g Nagase XD-1000 resin, 8g DMAc solvent, 4.3g Mitsubishi MA-100, 0.4g talcum powder in order, Stir at high speed for 2 hr to obtain black ink B.

Embodiment 3

[0058] This example prepares a kind of black ink, number is C, and component and preparation method are:

[0059] ODA, 2,2-bis(4-(4-aminophenoxy)phenyl)propane two diamines; and BPADA, BTDA acid anhydride are added to the NMP solvent in a molar ratio of 1:1, wherein the solid content 20%, fully mixed and stirred in a water bath at 5°C for 8 hours to obtain PAA acid.

[0060] Add acetic anhydride and pyridine to the PAA acid synthesized in the first step at a molar ratio of 2:1:1 to acid anhydride and dehydrate at 90°C for 7 hours to obtain soluble polyimide 3.

[0061] Add the above 32g soluble polyimide 3 solution, 4.2g Clariant OP-935, 7.72g Nagase XD-1000 resin, 8g DMAc solvent, 0.5g nigrosine, and 1.0g talcum powder in order, and stir at high speed 2hr, black ink C was obtained.

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Abstract

The invention provides black printing ink which comprises dissoluble polyimide, a flame retardant, resin, DMAC, carbon black and talc powder. A black coverage film prepared by the black printing ink is relatively low in price and wide in source of production raw materials, and performance such as black degree, transmissivity, shading property, matte degree and the like can be adjusted according todemands of clients. The black coverage film prepared by the black printing ink has the advantages that the black printing ink layer is separated from a glue layer for protecting wires, so that the problem of short circuit among the protected wires in a circuit board can be solved effectively.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit boards, and in particular relates to black ink and its preparation method and application. Background technique [0002] Compared with ordinary cover films, black cover films are opaque and non-reflective, and are mainly used in the preparation of LED light panels, car lights, etc. Since they do not reflect backlight, this opaque cover film can enhance the contrast of the light source and help improve The working efficiency of optoelectronic components; In addition, black cover film is also widely used in the manufacture of mobile phones. [0003] As far as the preparation technology of the black cover film is concerned, there are two commonly used technical approaches: one is to coat the ordinary cover film with glue on the black polyimide film (PI film); the other is to make a special black glue Coated on ordinary PI film. For mass production, the first way only needs to replace the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/03C08G73/10
CPCC08G73/1042C09D11/03C09D11/102
Inventor 徐海斌陈建平
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL
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