Preparation method of flexible stretchable sensor

A sensor and stretchable technology, applied in the field of the preparation of flexible stretchable sensors, can solve the problems of unreasonable circuit design, inaccurate detection results, and easy damage of flexible stretchable sensors, so as to reduce the number of leads and Complexity, high sensitivity, downsizing effect

Active Publication Date: 2019-02-22
BEIJING MECHANICAL EQUIP INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the embodiment of the present invention aims to provide a method for preparing a flexible stretchabl...

Method used

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  • Preparation method of flexible stretchable sensor
  • Preparation method of flexible stretchable sensor
  • Preparation method of flexible stretchable sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] A specific embodiment of the present invention discloses a method for preparing a flexible and stretchable sensor, such as figure 1 shown, including the following steps:

[0064] S1. Prepare a first tough substrate layer, on which a sensing module array and transmission wires between the sensing modules are prepared. The transmission wire has a non-linear structure. The sensing module includes a sensor and its control circuit.

[0065] S2. Deposit a tough substrate layer two on the array and the transmission wires between the sensing modules; the tough substrate layer two is in contact with the tough substrate layer one surface and covers the entire sensing module The array and the transmission wires between the sensing modules.

[0066] S3. Etching the tough substrate layer 1 and the tough substrate layer 2 to form stretchable parts and non-stretchable parts, wherein each stretchable part includes a transmission wire, and each non-stretchable part Includes a sensin...

Embodiment 2

[0071] Optimizing on the basis of Example 1, such as figure 2 As shown, in step S1, the preparation of the tough substrate layer 1 can be further refined into the following steps:

[0072] S11. Deposit a sacrificial layer on the substrate by sputtering or thermal growth process. Optionally, the substrate may be a silicon wafer or a glass wafer, and the sacrificial layer may be at least one of materials such as silicon oxide, silicon nitride, and craft glue.

[0073] S12. Prepare a tough substrate layer 1 on the sacrificial layer by spin-coating or using an adhesive bonding process. Optionally, the tough base material layer—may use at least one of materials such as PI, PET, PEN, PEI, PEEK, and Paylene.

[0074] Preferably, as image 3 As shown, in step S1, the first preparation of the sensing module array and the transmission wires between the sensing modules on the tough substrate layer can be further refined into the following steps:

[0075] S13. Prepare an M×N array fo...

Embodiment 3

[0094] The flexible and stretchable sensor prepared by the preparation method described in Example 2 is as follows: Figure 5 As shown, it includes an M×N array formed by M×N detection units, such as Image 6 with Figure 7 shown. Wherein, each of the detection units includes a stretchable part and a non-stretchable part; the sensing module of each detection unit is arranged on the non-stretchable part, and the wires provided by the stretchable part and the sensing of the adjacent detection unit module connection.

[0095] The non-stretchable part is used to collect external sensing information through the sensing module after the detection unit is turned on, and convert the external sensing information into electrical signals for transmission to the processor for processing. Image 6 with Figure 7 The middle non-stretchable part shows circular structures, but is not limited to circular structures.

[0096] The stretchable part is used for stretching under the action of ...

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Abstract

The invention, which belongs to the technical field of sensor preparation, relates to a preparation method of a flexible stretchable sensor so that problems that the existing flexible stretchable sensor is easy to damage, the detection result is inaccurate, and the circuit design is unreasonable can be solved. The preparation method comprises the following steps: preparing a flexible base materiallayer I; preparing an M*N detection array formed by arranging M*N sensing modules as well as a transmission wire; preparing a stretchable portion and a non-stretchable portion of a flexible stretchable sensor; and transferring the stretchable portion and the non-stretchable portion and enabling the portions to be in contact with a pre-prepared flexible base material structure to obtain a flexiblestretchable sensor. When the flexible stretchable sensor is in use, the flexible stretchable sensor realizes the macroscopic stretching function by the stretchable portion but the detecting functionof the non-stretchable portion is not affected. On the basis of the structural design of the non-stretchable portion, the electrical performance variation of the sensing module during the stretching process is avoided and thus the number reading becomes stable, reliable, and sensitive.

Description

technical field [0001] The invention relates to the technical field of sensor preparation, in particular to a method for preparing a flexible and stretchable sensor. Background technique [0002] The skin is the largest sensory organ in the human body, and it has good properties such as softness, extensibility (stretchability), array and perception. Electronic skin simulates human skin in terms of function and form, and is generally realized by flexible and stretchable sensors. [0003] Existing flexible and stretchable sensors generally adopt flexible sensors arranged on flexible substrates. When the flexible substrate is stretched, the flexible sensor and corresponding electronics on top of it will also be stretched. The flexible sensor is a high-precision sensor device, and its sensitivity is directly related to the sensor structure, material and electrical properties. During the stretching process, due to the distortion of the sensor structure, material modification, a...

Claims

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Application Information

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IPC IPC(8): G01D5/12H01L21/8234
CPCG01D5/12H01L21/823412H01L21/823437
Inventor 刘立滨许诺臧金良李平刘宇航刘秀洁
Owner BEIJING MECHANICAL EQUIP INST
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