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A loop heat pipe

By installing a flow stabilizing device in the rising tube of the heat pipe to separate the liquid phase and the vapor phase, the problems of low heat exchange efficiency and noise vibration caused by the mixing of vapor and liquid in the heat pipe are solved, and more efficient heat exchange and noise reduction effects are achieved.

Inactive Publication Date: 2020-04-14
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above problems, the present invention has been improved on the basis of the previous invention, and a new heat pipe is provided, thereby solving the problems of low heat transfer coefficient and uneven heat transfer in the case of heat pipe heat exchange

Method used

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Examples

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Embodiment Construction

[0046] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0047] In this article, if there is no special explanation, when it comes to formulas, " / " means division, and "×" and "*" mean multiplication.

[0048] Such as figure 1 A heat pipe shown includes an evaporation header 1, a condensation header 2, a rising pipe 3 and a return pipe 5, the rising pipe 3 communicates with the evaporation header 1 and the condensation header 2, and the evaporation header 1 Located in the lower part, the condensation header 2 is located in the upper part, the fluid absorbs heat and evaporates in the evaporation header 1, enters the condensation header 2 through the riser 3, condenses after exchanging heat in the condensation header 2, and the condensed fluid Return to the evaporation header 1 through the return pipe 5; a flow stabilization device 4 is arranged in the riser pipe 3, and the flow stabilization dev...

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PUM

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Abstract

This invention provides a loop heat pipe, comprising an evaporator manifold, a condenser manifold, a riser pipe, and a return pipe. The riser pipe is connected to both the evaporator and condenser manifolds. The evaporator manifold is located at the lower part, and the condenser manifold is located at the upper part. The fluid absorbs heat and evaporates in the evaporator manifold, then enters the condenser manifold through the riser pipe. After heat exchange in the condenser manifold, the fluid condenses, and the condensed fluid returns to the evaporator manifold through the return pipe. A flow stabilizing device is provided inside the riser pipe. The flow stabilizing device includes a central rod arranged along the central axis of the riser pipe and multiple radial rods extending radially along the central rod. Multiple fins extending downward from the radial rods are arranged on the radial rods, and the fins have pointed tips that face downwards. This invention provides a loop heat pipe with a novel flow stabilizing device structure. By providing radial rods and downward-pointing pointed fins, heat transfer is enhanced when there is vapor-liquid two-phase flow in the riser pipe, while simultaneously reducing riser pipe vibration and lowering noise levels.

Description

technical field [0001] The invention belongs to the field of heat pipes, in particular to a heat exchange heat pipe. Background technique [0002] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and phase change medium. The rapid heat transfer properties of the heat pipe quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds that of any known metal. [0003] Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better heat dissipation. The use of heat pipe technology enables the radiator to obtain a satisfacto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02F28F1/40F28F13/06
CPCF28F1/40F28D15/0266
Owner SHANDONG UNIV
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