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Liga fabrication process

A component, miniature technology, applied in 3D image production, patterned surface photoengraving process, 3D structure electroforming, etc., can solve the problems of complex manufacturing, alignment error, lack of dimensional accuracy, etc.

Inactive Publication Date: 2019-03-01
MASTER DYNAMIC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In structures or parts formed according to this method, there is often a cumulative effect of alignment errors as the number of layers of material increases, resulting in the final electroformed part which may not have the dimensional accuracy required for the part
Also, in the bonding process between the layers in this process, there is a complication of manufacturing

Method used

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  • Liga fabrication process
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Embodiment Construction

[0032] refer to Figure 1(a) , 1(b) , 1(c) and 1(d), schematic diagrams showing an example of a method according to the invention, by combining two-photon absorption and UV polymerization and then by electroforming, forming a clock regulation at the oscillation frequency of the regulation clock balance screw used in the machine. Referring to Figure 1(e), it is shown that the reference Figure 1(a) , 1(b) , 1 (c) and 1 (d) the method described in the cross section of the part formed, for the purpose of explaining the method according to the present invention, the part in this example is a balance screw 1 such as used in a clock.

[0033] As shown in FIG. 1( a), according to the method of the present invention, a conductive seed layer 13 is initially coated on a substrate 14, which is usually a thicker metal layer, formed by a sputtering process, and Has a thickness of typically about 100 nm.

[0034] The substrate 14 coated with the seed layer 13 is covered with a photores...

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Abstract

Provided is a process of forming a three-dimensional micro component, including the step of (i) forming a three-dimensional (3D) geometry contour within a photoresist material using two-photon absorption polymerization, wherein the three-dimensional geometry contour forms a cross-linked polymeric contour defining an outer surface portion of a micro component upon the three-dimensional geometry portion formed in the photoresist having been baked; and (ii) applying a UV (ultraviolet) polymerization process so as to cross-link polymeric material of the photoresist adjacent said three-dimensionalgeometry contour.

Description

technical field [0001] The present invention relates to a method of forming microcomponents, in particular, the invention relates to microcomponents formed using LIGA, ie using lithography (Lithographie), electroforming (Galvanoformung), injection (Abformung) micromolding processes. Background technique [0002] With the advent of miniaturization of mechanical equipment and components and electronic equipment and components, there is a high demand for the manufacture of miniature components with high and consistent dimensional accuracy and tolerances. [0003] Due to the versatility of 2D (two-dimensional) designs and the high fabrication precision brought about by lithography techniques, as known, X-ray LIGA and UV-LIGA techniques can be considered more commonly used for fabrication and production of micro-components. [0004] In the field, the favorable properties offered by X-ray LIGA include: high aspect ratio (approximately 100:1), feature of features with straight side...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/04C25D1/10
CPCG03F7/0037G03F7/038G03F7/2053G03F7/38G03F7/40C25D1/003G03F7/0002G03F7/2024G03F7/2022G03F7/70375
Inventor 王英男江争
Owner MASTER DYNAMIC LTD