System and method for online detecting life of CMP polishing pad
A polishing pad, life-span technology, applied in grinding/polishing equipment, parts of grinding machine tools, control of workpiece feed movement, etc., can solve the problem of inconsistent polishing pad wear, product yield and yield decline, and production efficiency. and other problems, to achieve the effect of improving the quality of flattening, making full use of it, and making small changes.
Inactive Publication Date: 2019-03-12
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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The invention relates to a system and a method for online detecting the life of a CMP polishing pad. According to the system and the method, the polishing pad provided with a groove is arranged on thesurface of a polishing table and rotates along with the polishing table; a wafer is pressed by a polishing head on the surface of the polishing pad, moves relative to the polishing table, and is subjected to flattening treatment; a light source and an optical detector are mounted on a component in a corresponding polishing area; a light beam is emitted by the light source to the surface of the polishing pad and reflected to the optical detector; and a signal from the optical detector is online received by a controller, the depth of the groove is calculated by the controller according to the strength of the signal, and the remaining working time of the polishing pad is judged by the controller. The invention further provides a method for online adjusting CMP process parameters based on polishing pad life detection. According to the remaining working time of the polishing pad, the CMP process parameters such as the flattening time, the rotating speed of the polishing table, the rotatingspeed of the polishing head, the pressure of the polishing head, the flow rate of a polishing fluid, the temperature of a polishing disc, and other factors capable of controlling the wafer flatteningremoval efficiency can be adjusted online, and then the wafer flattening efficiency and flattening quality can be improved.
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