System and method for online detecting life of CMP polishing pad
A polishing pad, life-span technology, applied in grinding/polishing equipment, parts of grinding machine tools, control of workpiece feed movement, etc., can solve the problem of inconsistent polishing pad wear, product yield and yield decline, and production efficiency. and other problems, to achieve the effect of improving the quality of flattening, making full use of it, and making small changes.
Inactive Publication Date: 2019-03-12
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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Problems solved by technology
[0009] Among them, the disadvantage of methods 1 and 2 is that, due to fluctuations in parameters such as the speed of the polishing table, the speed of the polishing head, the flow rate of the polishing liquid, and the temperature, it is easy to cause the wear of the polishing pad under the same working time or the same number of planarized wafers Inconsiste
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[0041] refer to figure 1 and figure 2 Shown, provide an embodiment of the online detection system of polishing pad life:
[0042] The system includes a polishing table 3 , the polishing pad 2 with grooves is pasted on the upper surface of the polishing table 3 and rotates together with the polishing table 3 . A light source 4 and an optical detector 5 are arranged above the polishing area. The light source 4 emits a light beam 6 to the surface of the polishing pad 2 and is reflected to the optical detector 5 by the surface of the polishing pad 2 .
[0043] The light source 4 and the optical detector 5 may be an integrated photoelectric sensor; or, the light source 4 and the optical detector 5 may be independent components.
[0044] A polishing head 1 carrying a wafer is arranged above the polishing table 3 , and the light source 4 and the optical detector 5 can be installed on a polishing arm 8 that fixes the polishing head 1 .
[0045] A nozzle for supplying polishing liq...
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The invention relates to a system and a method for online detecting the life of a CMP polishing pad. According to the system and the method, the polishing pad provided with a groove is arranged on thesurface of a polishing table and rotates along with the polishing table; a wafer is pressed by a polishing head on the surface of the polishing pad, moves relative to the polishing table, and is subjected to flattening treatment; a light source and an optical detector are mounted on a component in a corresponding polishing area; a light beam is emitted by the light source to the surface of the polishing pad and reflected to the optical detector; and a signal from the optical detector is online received by a controller, the depth of the groove is calculated by the controller according to the strength of the signal, and the remaining working time of the polishing pad is judged by the controller. The invention further provides a method for online adjusting CMP process parameters based on polishing pad life detection. According to the remaining working time of the polishing pad, the CMP process parameters such as the flattening time, the rotating speed of the polishing table, the rotatingspeed of the polishing head, the pressure of the polishing head, the flow rate of a polishing fluid, the temperature of a polishing disc, and other factors capable of controlling the wafer flatteningremoval efficiency can be adjusted online, and then the wafer flattening efficiency and flattening quality can be improved.
Description
technical field [0001] The invention relates to a system and a method for on-line detection of the life of a polishing pad, in particular to a system and a method for on-line detection of the life of a CMP polishing pad. Background technique [0002] Chemical mechanical polishing, also known as chemical mechanical planarization (CMP) or chemical mechanical polishing (CMP), is a process technology capable of achieving global and local planarization of semiconductor components (such as wafers). [0003] The CMP equipment includes a polishing table, the surface of the polishing table is provided with a polishing pad; above the polishing table, a polishing head is provided to clamp the wafer to be processed, and a certain pressure is applied to press the wafer tightly against the surface of the polishing pad. surface; the polishing head and the polishing table move or rotate relative to each other, and at the same time, the polishing liquid composed of abrasive grains and chemic...
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Login to view more IPC IPC(8): B24B37/005B24B37/10B24B49/12B24B57/02B24B53/017
CPCB24B37/0053B24B37/10B24B49/12B24B53/017B24B57/02
Inventor 顾海洋王东辉张志军古枫
Owner HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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