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Novel chip capacitor

A chip capacitor, a new type of technology, applied in capacitors, multilayer capacitors, fixed capacitors and other directions, can solve the problems of affecting product performance, electrode terminals are easy to fall off, poor heat dissipation effect, etc., to improve service life, improve heat dissipation performance, Good heat dissipation effect

Inactive Publication Date: 2019-03-12
苏州昇攀新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Chip capacitors, also known as multilayer chip ceramic capacitors, are commonly used components with a relatively large amount at present. Multilayer chip ceramic capacitors (abbreviated MLCC) are chip capacitors suitable for SMT surface mounting. Almost all electronic components Computers must be used in supporting applications, especially computers, mobile communication products, digital cameras, high-definition large-screen color TVs, and automotive electronics products. The demand for MLCC products is increasing day by day. This capacitor is composed of multilayer inner electrodes and dielectric Layers are alternately superimposed and sintered. It is a laminated capacitor. The dielectric layer material of this capacitor is usually ceramics, and the electrodes at both ends are connected by multi-layer internal electrode sheets in the dielectric layer material. It has the advantages of small size and high withstand voltage. , and can replace traditional aluminum electrolytic capacitors and tantalum electrolytic capacitors in some fields. It is easy to cause the electrode to bend and affect the performance of the product. Therefore, further improvement is needed

Method used

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Embodiment Construction

[0018] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0019] Such as Figure 1-Figure 3 As shown, a new chip capacitor includes a ceramic main body 1, a first electrode terminal 2 and a second electrode terminal 3 are respectively fixed on both sides of the ceramic main body 1, and the first electrode terminal 2 is located on the second electrode terminal. On the left side of the pole 3, three groups of first electrode pieces 4 are equidistantly fixed on the side of the first electrode end 2 close to the ceramic main body 1, and equidistantly fixed on the side of the second electrode end 3 close to the ceramic main body 1. There are three sets of second electrode sheets 5, and the first electrode sheets 4 and the secon...

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Abstract

The invention relates to a novel chip capacitor, comprising a ceramic main body, wherein a first electrode end and a second electrode end are respectively fixed on two sides of the ceramic main body,the first electrode end is located on a left side of the second electrode end, thee groups of first electrode sheets are equidistantly and fixedly arranged on one side of the first electrode end closeto the ceramic main body, the heat dissipation performance is good, the bending resistance performance of the electrode end is good, a heat collection layer absorbs the heat in an inner cavity of theceramic main body, and the heat is transferred by a heat conducting layer to a heat dissipation layer for heat dissipation, so that the product has good heat dissipation property, a silver plating layer, a nickel plating layer and a tin-lead mixed layer are sequentially stacked from the inside to the outside to form the first electrode end, thereby improving the bending resistance of the first electrode end, a semicircular protrusion is arranged on the outer side of the ceramic main body to increase the friction force between the ceramic main body and the heat collection layer to prevent theheat collection layer from falling off on one hand, and on the other hand, the heat dissipation area is increased and the heat dissipation performance is improved, and chamfers are symmetrically and fixedly arranged at the top and the bottom of the ceramic main body to prevent the first electrode end and the second electrode end from falling off.

Description

technical field [0001] The invention relates to a novel chip capacitor, which belongs to the technical field of electronic components installation structure. Background technique [0002] Chip capacitors, also known as multilayer chip ceramic capacitors, are commonly used components with a relatively large amount at present. Multilayer chip ceramic capacitors (abbreviated MLCC) are chip capacitors suitable for SMT surface mounting. Almost all electronic components Computers must be used in supporting applications, especially computers, mobile communication products, digital cameras, high-definition large-screen color TVs, and automotive electronics products. The demand for MLCC products is increasing day by day. This capacitor is composed of multilayer inner electrodes and dielectric Layers are alternately superimposed and sintered. It is a laminated capacitor. The dielectric layer material of this capacitor is usually ceramics, and the electrodes at both ends are connected ...

Claims

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Application Information

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IPC IPC(8): H01G4/12H01G4/30H01G4/232H01G4/002
CPCH01G4/12H01G4/002H01G4/2325H01G4/30
Inventor 宋彦鹏
Owner 苏州昇攀新材料技术有限公司
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