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A silicon particle assembly mold and assembly method thereof

An assembly method and a technology of silicon particles, which are applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of affecting the molding effect, poor adaptability, and affecting the welding effect, etc.

Active Publication Date: 2021-09-14
黄山市祁门县锦城电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Silicon particle is a semiconductor device that converts AC power into DC power. The middle-stage production process of silicon particles mainly includes three steps: welding, pickling and molding. Connect to form ohmic antennae. Commonly used welding molds, because there is a gap between the metal lead and the socket, in actual production, it will cause the metal lead to shake and affect the welding effect; in the molding process, the molding machine needs to reach a certain level. Temperature and pressure, put black glue in for molding. In this process, the mold used for molding directly affects the molding quality of the diode. The commonly used molds for molding have poor adaptability and affect the molding effect.

Method used

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  • A silicon particle assembly mold and assembly method thereof
  • A silicon particle assembly mold and assembly method thereof
  • A silicon particle assembly mold and assembly method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 The silicon particle assembly mold shown includes two upper molds 1 and a fixed splint 2 set up in parallel, and a mold shell 3 is provided on the side of the fixed splint 2 .

[0041] Such as Figure 2 to Figure 3 As shown, the top surface of the upper mold 1 is evenly distributed with placement holes 11, and lead wires 12 are movably installed in the placement holes 11, and a storage tray 13 is movably installed on the top surface of the lead wire 12, and a welding piece 131 and a chip 132 are sequentially installed in the storage tray 13. The bottom surface of the soldering sheet 131 is flexibly connected to the lead 12, and the top surface of the soldering sheet 131 is flexibly connected to the chip 132;

[0042] Two symmetrical arc-shaped installation grooves 111 are fixedly installed on the edge of the top surface of the placement hole 11 .

[0043] Such as Figure 4 to Figure 7 As shown, the fixed splint 2 includes two upper splints 21 and low...

Embodiment 2

[0050] The invention provides an assembly method for assembling silicon particles using the assembly mold, characterized in that: the assembly method includes the following steps:

[0051] Step 1: Place the upper end of the lead wire 12 into the placement hole 11, place the lower end of the lead wire 12 at the center of the third connection hole 2422, pull the pull button 2413, and make the arc-shaped stopper 2426 close to the lead wire 12, thereby fixing the position of the lead wire 12 ;

[0052] Step 2: Put the storage tray 13 into the top surface of the lead wire 12 one by one, that is to complete the mold clamping and obtain the mold clamping tube;

[0053] Step 3: Put the clamping tube into the welding furnace for initial welding, set the welding shielding gas as nitrogen, set the initial welding temperature as 280°C, and set the initial welding time as 3 minutes. After the initial welding is completed, perform middle welding, and set the middle welding temperature as 3...

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Abstract

The invention discloses a silicon particle assembly mould, which comprises two upper molds set up in parallel and a fixed splint, and a mold case is arranged on the side of the fixed splint. The present invention facilitates fixing the position of the lead wire by setting the clamping mechanism on the fixed splint, preventing the lead wire from shaking and affecting the welding effect; through the setting of the mold shell, a special mold for silicon particles is set, and it is easy to disassemble to ensure the molding effect; the design of the present invention is passed The assembling method for assembling the silicon particles by the assembling mold is simple and convenient to operate, saves manpower, and ensures the quality of products in the mid-stage production process of the silicon particles.

Description

technical field [0001] The invention belongs to the field of rectifier diodes, in particular to a silicon particle assembly mold and an assembly method thereof. Background technique [0002] Silicon particle is a semiconductor device that converts AC power into DC power. The middle-stage production process of silicon particles mainly includes three steps: welding, pickling and molding. Connect to form ohmic antennae. Commonly used welding molds, because there is a gap between the metal lead and the socket, in actual production, it will cause the metal lead to shake and affect the welding effect; in the molding process, the molding machine needs to reach a certain level. The temperature and pressure are put into black glue for molding. During this process, the mold used for molding directly affects the molding quality of the diode. The commonly used molds for molding have poor adaptability and affect the molding effect. Contents of the invention [0003] The purpose of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67121
Inventor 李国平
Owner 黄山市祁门县锦城电器有限公司