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Circuit board and semiconductor module

A circuit substrate, semiconductor technology, applied in the direction of semiconductor devices, circuits, semiconductor/solid-state device components, etc., can solve problems such as poor installation

Active Publication Date: 2019-03-15
KK TOSHIBA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the ceramic circuit board is bent, it is easy to cause poor mounting when mounted on a heat sink

Method used

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  • Circuit board and semiconductor module
  • Circuit board and semiconductor module
  • Circuit board and semiconductor module

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Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～2

[0082] Two types of substrates shown in Table 1 were prepared as silicon nitride substrates.

[0083] [Table 1]

[0084]

[0085] Next, the ceramic circuit boards shown in Table 2 were fabricated using copper plates. The bonding of the silicon nitride substrate and the copper plate is performed by an active metal bonding method. As the active metal solder, Ag (55% by mass), Cu (30% by mass), In (10% by mass), and Ti (5% by mass) were prepared. Mix with a resin binder to make an active metal solder paste, and apply it on a silicon nitride substrate with a thickness of 20 μm. Next configure the copper plate, and in a vacuum atmosphere (1×10 －3 Pa or less), the heat bonding process is performed at 780 to 830°C.

[0086] Next, an etching process is performed. The watch metal plate is etched into a patterned shape. By etching the side surface of the front metal plate, the size of the overflow of the bonding layer and the contact angle θ between the overflow of the bonding ...

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Abstract

A circuit board, provided with: a ceramic substrate having a first surface and a second surface; a first metal part having a first metal plate joined to the first surface and convex parts projecting from the surface of the first metal plate; and a second metal part having a second metal plate joined to the second surface. When the ceramic substrate is equally divided along the long side directioninto first through third divided parts, V1, V2, V3, V4, V5, and V6 are numbers satisfying (V4 / V1) + (V6 / V3) <= 2(V5 / V2), 0.5 <= V4 / V1 <= 2, 0.5 <= V5 / V2 <= 2, and 0.5 <= V6 / V3 <= 2.

Description

technical field [0001] Embodiments relate to circuit boards and semiconductor modules. Background technique [0002] In recent years, along with the high performance of industrial equipment, the output of power modules mounted on industrial equipment has been increasing. Along with this, the increase in output of semiconductor devices is progressing. The operation guaranteed temperature of semiconductor elements is 125°C to 150°C, and it is expected to rise to more than 175°C in the future. [0003] With the increase in the operation guarantee temperature of semiconductor elements, high thermal cycle test (TCT) characteristics are required for ceramic metal circuit boards. TCT is a method of measuring the durability of ceramic metal circuit boards with a cycle of low temperature → room temperature → high temperature → room temperature. [0004] Examples of conventional ceramic metal circuit boards include ceramic metal circuit boards having solder overflow portions withou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/13H01L23/36
CPCH01L23/13H01L23/36H05K1/0306H05K1/0271H05K2201/2009H05K2201/09136H05K1/0265H05K1/0209H05K2201/098H05K2201/0367H05K2201/09154H05K3/4015H05K2201/1031H05K2201/10318H05K2203/0285H05K2203/0278H05K2203/0369H01L24/32H01L24/29H01L23/49811H01L2924/3511H01L2224/291H01L2224/32225H01L2224/80205H01L2224/80203H01L2224/83815H01L2224/08225H01L24/80H01L24/83H01L23/3735H01L23/15H05K2201/09827Y02P70/50H01L2924/014H01L2924/00014B23K1/0016H01L23/3675H05K1/0201H05K3/202
Inventor 加藤宽正佐野孝
Owner KK TOSHIBA