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A high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material and its preparation method

A bonding material, high temperature resistant technology, applied in interlayer bonding material, high temperature resistant, high viscosity, high strength and high toughness interlayer bonding material and preparation fields, can solve the problems of poor impact resistance, low toughness, etc., to achieve bonding Excellent effect, poor impact resistance improvement, low epoxy resin toughness improvement effect

Active Publication Date: 2020-12-08
CHANGAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the defects and deficiencies in the prior art, the present invention provides a high-temperature-resistant, high-viscosity, high-strength, high-toughness interlayer bonding material and its preparation method, which overcome the defects of low toughness and poor impact resistance of the existing bonding materials

Method used

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  • A high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material and its preparation method
  • A high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material and its preparation method
  • A high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material and its preparation method

Examples

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Effect test

Embodiment 1

[0046] This embodiment provides a high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material, which is made of the following raw materials in parts by weight: 15 parts of polytetrahydrofuran ether glycol (PTMG), isophorone diisocyanate ( IP-DI) 5 parts, succinic anhydride 5 parts, diethanolamine 5 parts, trimethylolpropane 4 parts, heterocyclic aramid fiber 35 parts, epoxy resin 100 parts, triethylenetetramine 12 parts.

[0047] The heterocyclic aramid fiber in this example is a five-membered nitrogen-containing heterocyclic polyaramid, and its specific structural formula is:

[0048]

[0049] Wherein: n ranges from 100 to 1000. The heterocyclic aramid fiber is a five-membered nitrogen-containing heterocyclic polyarylamide synthesized by high-temperature solution polymerization whose starting monomers are 2,5-diaminothiazole and terephthalic acid. In organic solvents such as dimethyl sulfoxide and N,N-dimethylformamide, the melt...

Embodiment 2

[0074] This embodiment provides a high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material, which is made of the following raw materials: 18 parts of PTMG, 7 parts of IP-DI, 7 parts of succinic anhydride, 8 parts of diethanolamine, 5 parts of trimethylolpropane, 35 parts of heterocyclic aramid fiber, 100 parts of epoxy resin, and 12 parts of triethylenetetramine.

[0075] The selection and specification of raw material in the present embodiment are identical with embodiment 1.

[0076] The preparation method of the high-temperature-resistant, high-viscosity, high-strength and high-toughness interlayer adhesive material of this embodiment is the same as that of Embodiment 1.

Embodiment 3

[0078] This example provides a high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material, which is made of the following raw materials in parts by weight: 20 parts of PTMG, 10 parts of IP-DI, 10 parts of succinic anhydride, and 10 parts of diethanolamine , 8 parts of trimethylolpropane, 35 parts of heterocyclic aramid fiber, 100 parts of epoxy resin, and 12 parts of triethylenetetramine.

[0079] The selection and specification of raw material in the present embodiment are identical with embodiment 1.

[0080] The preparation method of the high-temperature-resistant, high-viscosity, high-strength and high-toughness interlayer adhesive material of this embodiment is the same as that of Embodiment 1.

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Abstract

The invention discloses a high-temperature-resistant high-viscosity high-strength and high-toughness interlayer binding material and a preparation method. The interlayer binding material is prepared from the following raw materials in parts by weight: 15-20 parts of polytetrahydrofuran ether glycol, 5-10 parts of isophorone diisocyanate, 5-10 parts of succinic anhydride, 5-10 parts of diethanol amine, 4-8 parts of trimethylolpropane, 30-40 parts of heterocyclic aramid fibers, 100 parts of epoxy resin and 10-15 parts of polyethylene polyamine. The preparation method of the interlayer binding material comprises the steps of preparation of aliphatic hyperbranched polyurethane, surface treatment on the heterocyclic aramid fibers, surface grafting treatment on the heterocyclic aramid fibers, modification of the heterocyclic aramid fibers and the epoxy resin through the hyperbranched polyurethane to prepare a hyperbranched polyurethane modified heterocyclic aramid fiber epoxy resin curing agent, and adding of the prepared curing agent in the epoxy resin to obtain the interlayer binding material. The interlayer binding material has excellent properties of high strength, high toughness, impact resistance and the like, a preparation process is simple, and a reaction process is controllable.

Description

technical field [0001] The invention belongs to the field of road materials, and relates to an interlayer bonding material, in particular to a high-temperature-resistant, high-viscosity, high-strength, and high-toughness interlayer bonding material and a preparation method thereof. Background technique [0002] The damage of bridge deck pavement adhesive layer is a main cause of bridge deck pavement disease. The quality of bridge deck pavement bonding directly affects the safety and comfort of driving, and even the service life of the bridge; good waterproof bonding The layer can improve the shear resistance of the pavement layer and reduce the occurrence of early diseases such as shifting, wrapping, and water seepage of the pavement layer. Epoxy resin has excellent bonding properties, high modulus, high strength, and good chemical resistance. During long-term research at home and abroad, it has been found that epoxy resin has obvious advantages in bridge deck waterproofing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C08G18/10C08G18/32C08G18/34C08G18/48C08G18/66C08G18/75C08G59/40C08G59/44C08G59/50D06M11/70D06M13/322D06M15/568D06M101/36
CPCC08G18/10C08G18/3206C08G18/3275C08G18/341C08G18/4854C08G18/6692C08G18/755C08G59/4057C08G59/44C08G59/5006C08L2205/16C09J11/08C09J163/00D06M11/70D06M13/322D06M15/568D06M2101/36C08G18/0823C08G18/32C08L77/10
Inventor 王朝辉傅豪左志武陈谦陈宝张长林李林李彪
Owner CHANGAN UNIV