Preparation method of novel normal-temperature low-pressure-change high-damping material
A technology with low pressure change and high damping, which is applied in the field of preparation of new normal temperature, low pressure and high damping materials. It can solve the problems of poor compression permanent deformation performance and limited popularization and application of high damping butyl rubber, and achieve excellent mechanical properties, excellent mechanical properties, Reduces the effect of compression set
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] A method for preparing a new type of damping material at normal temperature and low pressure, comprising the following steps:
[0024] S1: Select each component according to the proportions of 55% butyl rubber, 5% phenolic resin, 3% zinc oxide, 1% stearic acid, 1.5% antioxidant, and 34.5% modified silica filler, with a total mass of 500g;
[0025] S2: According to the ratio of each substance in S1, the above substances are sequentially added to the open mill in the order of butyl rubber, zinc oxide, stearic acid, antioxidant, phenolic resin and modified silica filler for kneading and tableting ; During mixing, the drum temperature is 40~60℃, the roll distance is 1~4mm, and the mixing time is 10~20min;
[0026] S3: Use a flat vulcanizer to vulcanize the rubber compound in S2; the vulcanization conditions are: the vulcanization temperature is 160℃±10℃, the vulcanization time is 25-30min, and the vulcanization pressure is 10-20Mpa.
[0027] The hardness of the obtained ru...
Embodiment 2
[0029] A method for preparing a new type of damping material at normal temperature and low pressure, comprising the following steps:
[0030] S1: Select each component according to the proportions of butyl rubber 76.5%, phenolic resin 7%, zinc oxide 5%, stearic acid 1.5%, anti-aging agent 2%, and modified silica filler 8%, with a total mass of 500g;
[0031] S2: According to the ratio of each substance in S1, the above substances are sequentially added to the open mill in the order of butyl rubber, zinc oxide, stearic acid, antioxidant, phenolic resin and modified silica filler for kneading and tableting ; During mixing, the drum temperature is 40~60℃, the roll distance is 1~4mm, and the mixing time is 10~20min;
[0032] S3: Use a flat vulcanizer to vulcanize the rubber compound in S2; the vulcanization conditions are: the vulcanization temperature is 160℃±10℃, the vulcanization time is 25-30min, and the vulcanization pressure is 10-20Mpa.
[0033] The hardness of the obtaine...
Embodiment 3
[0035] A method for preparing a new type of damping material at normal temperature and low pressure, comprising the following steps:
[0036] S1: Select each component according to the proportions of butyl rubber 66.5%, phenolic resin 6%, zinc oxide 4%, stearic acid 1.2%, antioxidant 1.8%, and modified silica filler 11%, with a total mass of 500g;
[0037] S2: According to the ratio of each substance in S1, the above substances are sequentially added to the open mill in the order of butyl rubber, zinc oxide, stearic acid, antioxidant, phenolic resin and modified silica filler for kneading and tableting ; During mixing, the drum temperature is 50°C, the roller distance is 3mm, and the mixing time is 15min;
[0038] S3: Use a flat vulcanizer to vulcanize the rubber compound in S2; the vulcanization conditions are: the vulcanization temperature is 150°C, the vulcanization time is 28min, and the vulcanization pressure is 18Mpa.
[0039] The invention has the characteristics of hi...
PUM
Property | Measurement | Unit |
---|---|---|
tensile strength | aaaaa | aaaaa |
tensile strength | aaaaa | aaaaa |
tensile strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com