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Laser die cutting machine

A laser die-cutting and die-cutting machine technology, applied in laser welding equipment, welding equipment, metal processing, etc., can solve the problems of low efficiency, low precision, and limited length of processed materials in the die-cutting process, and achieve high automation, Improve die-cutting precision and achieve effective control

Pending Publication Date: 2019-03-26
SHANGHAI DIZI PAPER PLASTIC TECH CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to solve the problems in the prior art that the length of the material processed by the laser die-cutting machine is limited, the precision is not high due to the movement of the laser galvanometer, and the efficiency of the die-cutting process is low.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0037] as attached figure 1 As shown, it is a structural schematic diagram of a laser die-cutting machine in this embodiment. The laser die-cutting machine in this embodiment includes a laser 11, a servo motor, and a reciprocating feeding system. The reciprocating feeding system includes a traction device and a driven device. The servo motor controls the operation of the reciprocating feeding system. In this embodiment, the traction device is a traction roller 22, the driven device is a driven roller 21, the traction roller 22 is close to the side of the discharge port 14, and the driven roller 21 is close to the side of the feed port 13; the traction roller 22 cooperates with the driven roller 21 to make the material 12 move back and forth: to make the material 12 move longitudinally to the first direction or to the second direction; The direction of the material outlet 14 moves; when the driven roller 21 receives the material and the traction roller 22 discharges the materi...

Embodiment 2

[0044] as attached figure 2 Shown is a schematic structural view of a laser die-cutting machine provided in this embodiment. It can be seen from the figure that the laser die-cutting machine provided in this embodiment includes a main discharge shaft 15 and a lower compound removal system. The main discharge shaft 15 is close to the feed port 13 . Described lower compound throwing off system comprises compounding device and throwing off device; Said compounding device is positioned between main discharging shaft 15 and feed port 13 in the present embodiment, and described compounding device comprises compounding roller 33 and composite material discharging Axis 34; the peeling device is close to the discharge port 14 of the laser die-cutting machine, and the peeling device is located below the material after die-cutting by the laser 11. The peeling device in this embodiment includes a first peeling separation Roller 31 and first take-up shaft 32 .

[0045] Among them, the c...

Embodiment 3

[0049] as attached image 3 As shown, it is a schematic structural diagram of a laser die-cutting machine provided in this embodiment. The laser die-cutting machine provided in this embodiment includes the reciprocating feeding system of Embodiment 1 and the lower compound peeling system of Embodiment 2. The reciprocating feeding system and the composite peeling off system will not be repeated here. Obviously, the laser die-cutting machine provided in this embodiment has the functions of the laser die-cutting machine provided in Embodiment 1 and Embodiment 2. Here, only the difference Brief description here.

[0050] as attached image 3 As shown, the composite roll 33 and the composite material discharge shaft 34 are located between the main discharge shaft 5 and the composite device is located between the main discharge shaft 15 and the driven roller 21, and the driven roller 21 is close to the feed port 13; the first The separation roller 31 and the first winding shaft 32...

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Abstract

The invention provides a laser die cutting machine. The laser die cutting machine is a combined type multifunctional laser die cutting machine, the laser die cutting machine comprises any one or any two or combination of more than two of a reciprocated feeding system, a lower recombining and peeling off system, an upper waste discharge system, a slicing system, a flattening system, and a waste gasexhaust system. The laser die cutting machine can improve the laser die cutting finished product yield, the automatic waste discharge, automatic winding and automatic slicing of the die cutting flowcan be achieved, and related function modules of a die cutting device are simple in structure and convenient to maintain.

Description

technical field [0001] The invention relates to laser die-cutting technology, in particular to a laser die-cutting machine. Background technique [0002] With the rapid development of packaging and printing technology, compared with traditional die-cutting machines, laser die-cutting machines are more and more widely used due to the following advantages: Laser die-cutting is controlled by a computer and is not affected by the complexity of graphics. It can cut the cutting requirements that cannot be fulfilled by traditional die-cutting dies; without changing the die-cutting dies, it can quickly switch between different format jobs, saving the time for changing and adjusting die-cutting dies of traditional die-cutting, especially suitable for short-cut, personalized Die-cutting processing; the cutting graphic design can be completed on the computer, and various graphic parameter settings are automatically generated based on software. [0003] Therefore, for small batch order...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/70B26D3/28
CPCB23K26/38B23K26/402B23K26/702B26D3/28
Inventor 胡立山戴接才彭宗华何小燕
Owner SHANGHAI DIZI PAPER PLASTIC TECH CENT
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