LED epitaxial wafer and preparation method thereof
A technology of light-emitting diodes and epitaxial wafers, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced wave function overlap rate, influence on LED internal quantum efficiency, and reduced efficiency, so as to improve efficiency, improve internal quantum efficiency, The effect of reducing the piezoelectric effect
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[0028] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0029] figure 1 A method for preparing a light-emitting diode epitaxial wafer provided by an embodiment of the present invention is shown. see figure 1 , the method flow includes the following steps.
[0030] Step 101, providing a substrate.
[0031] Step 102 , sequentially depositing a buffer layer, an undoped GaN layer and an N-type doped GaN layer on the substrate.
[0032] Step 103, depositing a multi-quantum well layer on the N-type doped GaN layer.
[0033] Wherein, the multi-quantum well layer includes several stacked quantum well barrier layers. The quantum well barrier layer includes a well layer and a barrier layer stacked on the well layer. The well layer includes a first InGaN layer. The barrier layer includes an AlI...
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