Method of transferring micro device

Abstract

A method of transferring micro devices is provided and comprises the following steps. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closerto the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.

Description

technical field [0001] The invention relates to a transfer method, in particular to a transfer method of tiny components. Background technique [0002] Micro LED Display has the advantages of high brightness, high contrast, wide viewing angle, long life and low power consumption, and has become the focus of future display technology development. The technology of directly transferring micro LED crystals to the driver backplane is called mass transfer process, and the mass transfer process has the following difficulties. First, the size of micro-LEDs is extremely small (about 5 μm to 10 μm), requiring more refined operation techniques. In addition, only hundreds of thousands or millions of micro-LEDs can form a panel, and one transfer needs to move tens of thousands or even hundreds of thousands of micro-LEDs, which is a huge quantity. [0003] In the prior art, the mass transfer is usually carried out by using a mechanical electrostatic pick-up method or an adhesive sticky...

AI Technical Summary

Problems solved by technology

The adsorption head and mechanical arm of the mechanical electrostatic adsorption method are relatively large, and it is impossible to absorb micro-LEDs below 10 μm, and it cannot be transferred in large quantities

Adhesive adhesive method has the disadvantage of uneven adhesion. When the adhesive force is removed, the adhesive force drops unstable, causing yield problems. And because the tape area is too large, it is impossible to select the micro LED at a specific position.

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