Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-power remote phosphor-type white light led cooling package

A long-range phosphor, high-power technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of poor heat dissipation performance of LED packaging, and achieve the effect of improving aging probability and cost, reducing cost and reducing consumption.

Active Publication Date: 2019-07-30
XUYU OPTOELECTRONICSSHENZHEN CO LTD
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of poor heat dissipation performance of the existing LED package, the present invention proposes a high-power remote phosphor type white LED heat dissipation package

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-power remote phosphor-type white light led cooling package
  • High-power remote phosphor-type white light led cooling package
  • High-power remote phosphor-type white light led cooling package

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0018] Specific implementation mode one: combined Figure 1~3 To illustrate this embodiment, the high-power remote phosphor-type white light LED heat dissipation package in this embodiment is composed of a substrate 1, a chip 2, a heat-conducting ring 3, a condenser lens 5, a supporting lens 6, and a phosphor structure layer 7;

[0019] The upper surface of the substrate 1 is provided with a cylindrical boss 11, and the center of the upper surface of the boss 11 is provided with a rounded truncated blind hole 12. The inner wall of the blind hole 12 is a reflective surface; the heat conduction ring 3 is annular, and the heat conduction ring 3 An annular protrusion 31 is arranged on the upper surface close to the inner peripheral surface, and the diameter of the outer circumference of the annular protrusion 31 decreases from bottom to top, and the inner peripheral surface of the annular protrusion 31 is an inclined reflective surface; 31 is provided with an annular groove 33 con...

specific Embodiment approach 2

[0027] Embodiment 2: This embodiment is different from Embodiment 1 in that: the reflective surface of the inner wall of the blind hole 12 and the inclined reflective surface of the annular protrusion 31 in the heat conduction ring 3 are obtained by polishing or coating with a reflective coating; Alternatively, the reflective surface of the inner wall of the blind hole 12 and the inclined reflective surface of the annular protrusion 31 in the heat conduction ring 3 are plated with a nickel layer or a silver layer. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0028] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the encapsulating glue 4 is silica gel. Other steps and parameters are the same as those in Embodiment 1 or 2.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

High-power remote phosphor white LED heat-dissipation package relates to an LED heat-dissipation package, for solving the problem of poor heat dissipation of LED package structures. The substrate of the package structure is provided with a boss and a heat conducting ring, and the phosphor structural layer contains hollow glass microspheres. The white LED heat-dissipation package structure in the present invention improves the spatial chroma uniformity of the white light by using the hollow glass microspheres, thereby reducing the costs. The package structure can improve the heat dissipation efficiency of the chip and the utilization ratio of light emitted from the chip. The present invention is applicable to prepare high-power remote phosphor white LEDs.

Description

technical field [0001] The invention relates to an LED heat dissipation package. Background technique [0002] The principle of fluorescent conversion white light LED packaging is to coat a layer of phosphor powder on the surface of the LED chip. The phosphor powder generates light of other colors under the excitation of the light emitted by the chip, and mixes with the light emitted by the chip to produce white light. Remote phosphor-type white LED packaging is to fill a certain thickness of encapsulation glue between the phosphor powder and the LED chip, and use the encapsulation glue to isolate the phosphor powder and the LED chip, thereby increasing the distance between the phosphor powder and the chip and improving the light output efficiency of the lamp. [0003] Existing lamps using LED packages have the advantages of energy saving and high efficiency, but the light conversion efficiency of the LED chip in the LED package is about 20%~30%, and the conversion of the re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/58H01L33/60H01L33/64
CPCH01L33/501H01L33/504H01L33/507H01L33/58H01L33/60H01L33/642H01L33/644H01L33/505H01L33/641
Inventor 林金填曹小兵
Owner XUYU OPTOELECTRONICSSHENZHEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com