Inorganic thermoelectric device having room temperature flexibility and preparation method thereof

Abstract

The present invention discloses an inorganic thermoelectric device having room temperature flexibility for the first time. The inorganic thermoelectric device comprises an upper substrate, a lower substrate, an electrode, an anti-diffusion layer, and a thermoelectric bulk material having room temperature flexibility, wherein the upper substrate, the lower substrate, the electrode, and the anti-diffusion layer are all flexible inorganic materials. The inorganic thermoelectric bulk material having room temperature flexibility is used for preparing the thermoelectric device, and can take accountof both the thermoelectric performance and the flexibility of the thermoelectric device. The preparation method of the thermoelectric material is simple, achieves the construction of the p / n thermoelectric material, can further improve the performance of the obtained thermoelectric devices, and has important research and promotion significance.

Description

technical field [0001] The invention belongs to the field of thermoelectric material science and technology, and specifically relates to an inorganic thermoelectric device with room temperature flexibility and a preparation method thereof. Background technique [0002] Compared with traditional electronic devices, flexible electronic devices have completely different mechanical properties, including foldability, stretchability, bendability, etc., which have caused major changes in many fields such as electronic devices, optoelectronic devices, biomedicine, and energy storage. . Because the deformation stress of metals, alloys and organic materials can reach 5-100%, and the hard and brittle inorganic semiconductor materials are often only 0.1-0.2% due to the intrinsic characteristics of the crystal structure, and rarely exceed 1%. Flexible electronic devices usually fabricate organic / inorganic material electronics on flexible / ductile plastic or thin metal substrates. [000...

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Problems solved by technology

[0003] For thermoelectric devices, the performance of pure organic thermoelectric materials is low. Although the thermoelectric devices prepared by using them have good flexibility, the power generation and cooling efficiency is not high, which cannot meet the actual needs.

On the other hand, although inorganic thermoelectric materials have better thermoelectric properties than organic thermoelectric materials, they are usually brittle at room temperature. Although they can be used in conjunction with flexible substrates to build macroscopically "flexible" devices, each thermoelectric unit It is still rigid, and it is extremely vulnerable to damage by external forces or internal stress during actual use

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