Chamfering grinding wheel, chamfering grinding device and grinding method

A grinding device and grinding method technology, applied in the direction of grinding machines, grinding machine parts, grinding/polishing equipment, etc., can solve the problems of low processing efficiency, waste, large resources, etc., and achieve the effect of improving production efficiency

Inactive Publication Date: 2019-04-16
XIAN ESWIN SILICON WAFER TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the traditional chamfering grinding process, the grinding system consists of a chamfering grinding wheel with the same groove spacing, and a grinding table that can move freely in the three-dimensional space, such as the X-axis, Y-axis, Z-axis direction and the circumferential direction of the coordinate system. The processing process goes through the handling, calibration, grinding and cleaning of silicon wafers. A single processing can complete the processing of a silicon wafer, and the processing efficiency is low. At the same time, compared with the cylindrical chamfering grinding wheel, only one sample is processed at a time. , the actual utilization rate is less than 1 / 4, resulting in a large waste of resources

Method used

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  • Chamfering grinding wheel, chamfering grinding device and grinding method
  • Chamfering grinding wheel, chamfering grinding device and grinding method
  • Chamfering grinding wheel, chamfering grinding device and grinding method

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

[0049] First, the chamfering grinding wheel 100 according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0050] like Figure 1 to Figure 2 As shown, the chamfering grinding wheel 100 according to the embodiment of the first aspect of the present invention includes a grinding wheel body 110 and ...

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Abstract

The invention provides a chamfering grinding wheel, a chamfering grinding device and a grinding method. The chamfering grinding wheel comprises a grinding wheel main body, and at least two grinding grooves peripherally formed in the outer peripheral surface of the grinding wheel main body; and the at least two grinding grooves are distributed on the axis of the grinding wheel main body at intervals. The chamfering grinding wheel can correspondingly machine more than two workpieces, so that the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor single crystal silicon wafer processing, in particular to a chamfering grinding wheel, a chamfering grinding device and a grinding method. Background technique [0002] Wafer, as the most important material in the semiconductor field, is a resource in short supply in the current market. Generally, single crystal silicon wafers undergo multiple processes such as growing, slicing, edge grinding, and lapping, and finally obtain semiconductor-grade wafers with good surface flatness and rounded edge morphology. , among which the chamfering process is one of the main processes, which is responsible for trimming edge damage, meeting customer requirements for wafer contours, and releasing internal stress. It is very important for wafer production capacity and quality requirements. [0003] In the traditional chamfering grinding process, the grinding system consists of a single chamfering grinding w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/06B24B41/04
Inventor 陈光林郑秉胄
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
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