Ion beam polishing process parameter determination method for six-axis motion polishing system

A technology of process parameters and ion beams, applied in the field of precision manufacturing, can solve problems such as time-consuming, and achieve the effect of shortening time, saving costs and avoiding waste

Active Publication Date: 2019-04-16
CHINA WEAPON SCI ACADEMY NINGBO BRANCH
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Problems solved by technology

If you use a different Faraday cup, you need to re-scan to obtain the corresponding value, which is time-consuming

Method used

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  • Ion beam polishing process parameter determination method for six-axis motion polishing system
  • Ion beam polishing process parameter determination method for six-axis motion polishing system
  • Ion beam polishing process parameter determination method for six-axis motion polishing system

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Embodiment Construction

[0039] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0040] The specific operation process of a method for determining the removal function of ion beam polishing for a six-axis motion polishing system of the present invention is as follows:

[0041] (1) Determine the removal function:

[0042] 1. Turn on the six-axis motion polishing system power supply, water cooling device, working argon gas, etc.

[0043] 2. Place the optical components and fix the optical components in the middle of the base plate with clamps or high-temperature tape.

[0044] 3. Vacuumize to ensure the vacuum state of the experiment. Pump up the main vacuum chamber first, wait until the pressure of the vacuum chamber reaches 5.0×10 -1 At Pa, the secondary vacuum chamber is evacuated until the pressure of the secondary vacuum chamber reaches 2.5×10 -1 At Pa, transport the optics to ...

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Abstract

The invention relates to an ion beam polishing process parameter determination method for a six-axis motion polishing system. The ion beam polishing process parameter determination method for the six-axis motion polishing system is based on an Sigmund sputtering theory, faraday scanning experiments with a limited number of times are used to determine the valves of a scaling factor and a constant C, so that an expression, of relative parameters, relative to a faraday scanning current density distribution curve, of the peak removal rate R<max>of a removal function and the full width at half maximum HR of the removal function is obtained, thus process parameters are adjusted, the faraday scanning current density distribution curve is obtained through the faraday scanning experiments, the parameters of the curve are used, thus the removal function can be obtained by calculating, and time of removal function determination is greatly shortened from two hours to five minutes. Therefore, the efficiency of simulated machining tests aiming at the different process parameters is improved, thus the optimum process parameter can be quickly determined. Furthermore, when the method is used for determining the removal function, etching experiments are not needed to conduct on all process parameters, so that waste of sample pieces is avoided, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of precision manufacturing, in particular to a method for determining ion beam polishing process parameters by measuring current density used in a six-axis motion polishing system. Background technique [0002] Ion beam polishing is usually used for the final processing of ultra-precision optical components. It is a polishing technology with removal accuracy reaching the atomic level. It is considered to be the optical component modification technology with the highest processing accuracy and the best modification effect. During this process, the ion beam with a certain energy and spatial distribution bombards the surface of the optical element, and the physical sputtering effect that occurs during the bombardment removes the surface material of the optical element to achieve the purpose of correcting the surface shape error, and the processing accuracy reaches the nanometer level. The traditional processing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B13/00B24B1/00B24B49/12
CPCB24B1/002B24B13/00B24B49/12
Inventor 李晓静王大森郭海林张旭裴宁冯时聂凤明
Owner CHINA WEAPON SCI ACADEMY NINGBO BRANCH
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