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An in-plane thermoelectric device structure design method based on COMSOL software

A technology for thermoelectric device and structural design, applied in design optimization/simulation, instrumentation, calculation, etc., can solve problems such as multi-cost, long cycle, heavy workload, etc., and achieve the effect of reducing experimental cost and time

Active Publication Date: 2019-04-16
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The actual preparation of thermoelectric devices to performance testing often takes a long period and costs a lot of money. If it is necessary to explore the working states of thermoelectric devices with various structures, the workload is even more arduous.

Method used

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  • An in-plane thermoelectric device structure design method based on COMSOL software
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  • An in-plane thermoelectric device structure design method based on COMSOL software

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Embodiment 1

[0059] According to the single-stage thermoelectric device design method in the present invention, the temperature distribution of the annular series thermoelectric device under the optimum working current is simulated. Including the following steps:

[0060] (1) Select the physical field:

[0061] Enter the main interface of the software, select "Model Wizard", select "3D" in "Spatial Dimension", select "Thermoelectric Effect" under the sub-module of the solid heat transfer module of the physics field, and select "Steady State" in "Research" .

[0062] (2) Establish a geometric physical model:

[0063] Select "Working Plane" in the main geometry window to enter the 2D graphics construction interface. Use the two-dimensional drawing tool to draw concentric circles with radii of 3.5mm and 4.5mm respectively, set the fan angle to 78°, and use the "Difference" tool under "Boolean operation and segmentation" to subtract the 4.5mm circle from the 3.5mm circle , to obtain a part...

Embodiment 2

[0074] According to the single-stage thermoelectric device design method in the present invention, the temperature distribution of the ring thermoelectric device under the optimum working current is simulated. Including the following steps:

[0075] (1) Select the physical field:

[0076] Enter the main interface of the software, select "Model Wizard", select "3D" in "Spatial Dimension", select "Thermoelectric Effect" under the sub-module of the solid heat transfer module of the physics field, and select "Steady State" in "Research" .

[0077] (2) Establish a geometric physical model:

[0078] Select "Working Plane" in the main geometry window to enter the 2D graphics construction interface. Use the two-dimensional drawing tool to draw concentric circles with radii of 3.5mm and 4.5mm, and use the "Difference" tool under "Boolean Operations and Segmentation" to subtract the 3.5mm circle from the 4.5mm circle to get the first circular pattern . In the same way, the circle w...

Embodiment 3

[0089] According to the multi-stage thermoelectric device design method in the present invention, the temperature distribution of the two-stage annular thermoelectric device under the optimum working current is simulated. Including the following steps:

[0090] (1) Select the physical field:

[0091] Enter the main interface of the software, select "Model Wizard", select "3D" in "Spatial Dimension", select "Thermoelectric Effect" under the sub-module of the solid heat transfer module of the physics field, and select "Steady State" in "Research" .

[0092] (2) Establish a geometric physical model:

[0093] Select "Working Plane" in the main geometry window to enter the 2D graphics construction interface. Use the two-dimensional drawing tool to draw concentric circles with radii of 3.5mm and 4.5mm, and use the "Difference" tool under "Boolean Operations and Segmentation" to subtract the 3.5mm circle from the 4.5mm circle to get the first circular pattern . In the same way, ...

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Abstract

The invention discloses an in-plane thermoelectric device structure design method based on COMSOL software, and the method comprises the following steps: selecting a three-dimensional space dimensionand a thermoelectric effect physical field in a COMSOL software model guide, and carrying out the steady-state research; Establishing a geometric physical model of the thermoelectric device needing tobe solved; Defining related global parameters and endowing model material attributes; Setting an initial value and boundary conditions of the model; Dividing grids and calculating; And changing boundary current conditions, calculating and comparing the boundary current conditions through COMSOL software to obtain the working state of the thermoelectric device under the optimal current, and carrying out post-processing on the obtained result. Numerical simulation of temperature fields of thermoelectric devices of different structures during working is achieved, the temperature field distribution rule of the thermoelectric devices is explored, the experiment cost and time are reduced, and theoretical guidance and technical support are provided for structure optimization of the thermoelectric devices.

Description

technical field [0001] The invention relates to the technical field of thermoelectric device structure design, in particular to an in-plane thermoelectric device structure design method based on COMSOL software. Background technique [0002] With the development of high integration and miniaturization of electronic components, the heating phenomenon of electronic components is becoming more and more serious, and it is usually concentrated in a confined space and difficult to radiate out, which seriously affects the performance and service life of electronic components. It is urgent to develop Efficient thermal management scheme. Thermoelectric refrigeration technology based on the Peltier effect of thermoelectric materials has the advantages of no noise, no pollution, rapid cooling, simple operation, strong reliability, and easy realization of high-precision temperature control. It is expected to solve the heat dissipation problem of high heat flux electronic devices, which ...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/20
Inventor 赵文俞方文兵聂晓蕾张清杰朱婉婷魏平孙志刚李鹏田烨
Owner WUHAN UNIV OF TECH
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