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Resin composition for semiconductor encapsulation, prepreg and clad laminate using same

A technology of resin composition and semiconductor, which is applied in the direction of metal layered products, semiconductor/solid device components, lamination, etc., and can solve the problems of reduced flow characteristics and restrictions of prepregs

Active Publication Date: 2021-02-09
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, filling prepregs with high filler content is limited due to the reduced flow characteristics of prepregs

Method used

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  • Resin composition for semiconductor encapsulation, prepreg and clad laminate using same
  • Resin composition for semiconductor encapsulation, prepreg and clad laminate using same
  • Resin composition for semiconductor encapsulation, prepreg and clad laminate using same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0170] (2) Preparation of prepreg and copper clad laminate

[0171] The resin composition for semiconductor encapsulation (resin varnish) prepared above was immersed in glass fiber (T-glass #1017, manufactured by Nittobo) with a thickness of 15 μm, and then dried with hot air at a temperature of 170° C. for 2 to 5 minutes to A prepreg having a thickness of 25 μm was prepared.

[0172] The two sheets of prepreg prepared above were laminated, and copper foil (12 μm in thickness, manufactured by Mitsui) was placed and laminated on both sides thereof, and heated at 220° C. and 35 kg / cm 2 Cured for 100 minutes under certain conditions.

[0173] [Table 1]

[0174] The composition of the resin composition for semiconductor encapsulation of the embodiment

[0175]

[0176]

[0177] *DDS: 4,4’-Diaminodiphenylsulfone

[0178] *TFB: 2,2’-bis(trifluoromethyl)benzidine; 2,2’-bis(trifluoromethyl)-4,4’-benzidine

[0179] *DDM: 4,4’-Diaminodiphenylmethane

[0180] *DDE: 4,4’-Diami...

experiment example

[0213]

[0214] The physical properties of the resin compositions for semiconductor encapsulation, prepregs, and copper clad laminates obtained in Examples and Comparative Examples were measured by the following methods, and the results are shown in Table 3 below.

[0215] 1. Coefficient of thermal expansion (CTE)

[0216] The copper foil layers of the copper clad laminates obtained in Examples and Comparative Examples were removed by etching, and then test specimens were prepared in the MD direction. The measurement was performed from 30°C to 260°C at a heating rate of 10°C / min by using TMA (TA Instruments, Q400), and the measured value in the temperature range of 50°C to 150°C was recorded as the coefficient of thermal expansion.

[0217] 2. Resin flow rate (RF)

[0218] (1) Initial resin flow rate

[0219]In the prepreg states obtained in Examples and Comparative Examples, RF was measured according to IPC-TM-650 (2.3.17) using a Carver press (Carver, Inc., #3893.4NE0000...

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Abstract

The present invention relates to a resin composition for semiconductor encapsulation, and a prepreg and metal clad laminate formed therefrom, the resin composition having high miscibility between internal components, low thermal expansion characteristics and excellent mechanical properties.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims the benefit of priority of Korean Patent Application No. 10-2017-0036105 filed on March 22, 2017 and Korean Patent Application No. 10-2018-0018019 filed on February 13, 2018, the full disclosure of which The contents are incorporated herein by reference. [0003] The present invention relates to a resin composition for semiconductor encapsulation, which has high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and metal clad laminate using the same characteristic. More particularly, the present invention relates to a thermosetting resin composition for semiconductor packaging, which can be produced to exhibit excellent physical properties even through a reflow process of a printed circuit board (PCB), and a prepreg using the same prepreg and metal clad laminates. Background technique [0004] C...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K5/17B32B15/14B32B37/10B32B37/06B32B5/02C08J5/24C08K3/013C08K9/06
CPCB32B5/02B32B15/14B32B37/06B32B37/10C08K3/36C08K5/17C08K9/06C08K3/013C08J2363/00C08J2479/04C08J5/244C08J5/249C08L63/00C08L79/00B32B2260/021B32B2260/046C08J5/24C08G59/5033C08J2363/02C08J2363/04C08K2201/003C08L63/04C08L79/085H01L23/49894C08K2201/005
Inventor 沈昌补沈熙用闵铉盛金荣灿宋升炫
Owner LG CHEM LTD
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