Double-color-temperature COB hybrid chip device and packaging method of COB system

A packaging method and dual-color temperature technology, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problem of dual-color temperature without stepless color matching, achieve high precision and high stability, and achieve color temperature and structure optimization. Effect

Inactive Publication Date: 2019-04-23
昆山琉明光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, at present, the dual color temperature produced by the COB hybrid chip does not have the effect of infinite color adjustment, and basically only has two color temperatures, which cannot meet the needs of users.

Method used

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  • Double-color-temperature COB hybrid chip device and packaging method of COB system

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Embodiment Construction

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for the purpose of description and to distinguish similar objects, and there is no sequence between the two, nor can they be construed as indicating or imply relative importance. Also, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0034] combine figur...

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Abstract

The invention discloses a double-color-temperature COB hybrid chip device and a packaging method of a COB system. The system comprises a COB system and a control circuit mechanism. The COB system comprises a control circuit board, a chip mechanism arranged on the control circuit board, and a fluorescent glue mechanism covered on the chip mechanism. The fluorescent glue mechanism comprises at leasttwo fluorescent glue units which can be mixed to generate the light, wherein the fluorescent glue units correspond to different light source light colors. The chip mechanism comprises a plurality ofchip units. The control circuit mechanism is electrically connected with the chip units, and the control circuit mechanism is used for outputting working voltage corresponding to input voltage of thecontrol circuit mechanism to the chip units. According to the method provided in the invention, the combination of mixed chips is adopted, and the voltage value of each chip unit is adjusted. Therefore, the stepless adjustment of the double color temperature can be realized, and the function is optimized.

Description

technical field [0001] The invention relates to the technical field of COB chips, in particular to a dual-color temperature COB hybrid chip device and a packaging method for a COB system. Background technique [0002] The descriptions in this section merely provide background information related to the present disclosure and do not constitute prior art. [0003] COB (Chips on Board) package is a package in which the LED chip is directly welded on the PCB board. According to data, the annual global COB business license market capacity is close to RMB 4 billion, a year-on-year increase of 6.5%. With the continuous expansion of the lighting application market, the requirements for light quality are getting higher and higher, which promotes the continuous innovation of packaging and chip technology applications, and the COB application technology is also gradually improving. To AL board + flip chip (filp chip) + integrated circuit + packaging, reduce the wire bonding process, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L25/075H01L25/16H01L33/48
CPCH01L25/0753H01L25/167H01L33/48H01L33/483H01L33/504H01L2933/0033H01L2933/0041
Inventor 郑攀付红超
Owner 昆山琉明光电有限公司
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