Structure for heat radiation middle frame or heat radiation rear case, heat radiation middle frame or heat radiation rear case and manufacturing method of heat radiation middle frame or heat radiation rear case

A rear shell and heat dissipation plate technology, which is applied in the fields of telephone structure, cooling/ventilation/heating modification, modification with liquid cooling, etc., can solve the problem of limited thickness design space, difficulty in effectively exerting the heat dissipation effect of gas-liquid change circulation, and hollow sealing Cavity deformation and other problems, to achieve the effect of accelerating heat circulation and dissipation, contributing to the efficient circulation of gas and liquid, and reducing the effect

Pending Publication Date: 2019-04-23
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in practical applications, if the volatile liquid is sealed in the hollow sealing structure according to this patent document, it will be difficult to realize. Due to the thin thickness of the middle frame, the hollow sealing cavity is prone to deformatio

Method used

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  • Structure for heat radiation middle frame or heat radiation rear case, heat radiation middle frame or heat radiation rear case and manufacturing method of heat radiation middle frame or heat radiation rear case
  • Structure for heat radiation middle frame or heat radiation rear case, heat radiation middle frame or heat radiation rear case and manufacturing method of heat radiation middle frame or heat radiation rear case
  • Structure for heat radiation middle frame or heat radiation rear case, heat radiation middle frame or heat radiation rear case and manufacturing method of heat radiation middle frame or heat radiation rear case

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Experimental program
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Example Embodiment

[0026] Example 1:

[0027] An embodiment of the present invention provides a heat dissipation middle frame. The heat dissipation middle frame is a heat dissipation middle frame of an intelligent electronic device, especially a heat dissipation middle frame of a smart phone. The heat dissipation middle frame is used to provide a carrier for a circuit board or an electronic component. After the electronic components are installed in the heat dissipation middle frame, the main board of intelligent electronic equipment is formed, such as the main board of a mobile phone, which has extremely high heat dissipation requirements. There is no doubt that the heat dissipation middle frame is made of a metal material with high thermal conductivity and weldable, which can be an alloy material ,like figure 1 As shown, the middle frame 101 is used as the carrier of the electronic components 102, and the electronic components 102 are installed on the surface of the middle frame 101 as a heat ...

Example Embodiment

[0034] Example 2:

[0035] An embodiment of the present invention provides a method for manufacturing a heat dissipation middle frame or a heat dissipation rear case, including the following steps.

[0036] First, prepare the materials for the production of heat dissipation middle frame or heat dissipation rear case. According to the design requirements of intelligent electronic devices, such as the installation position of the mobile phone’s heating chip on the middle frame, or the position of the corresponding rear case, in the heat dissipation middle frame or heat dissipation The housing groove is etched on the back shell and the pillars are also etched to make the channel unobstructed, and to ensure a more stable structure and not easy to be damaged. According to the thickness requirements of the heat sink, choose to sinter at least one layer of copper wire mesh or copper powder on the heat sink to form an adsorbent for absorbing liquid, which can have a capillary structur...

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Abstract

The invention discloses a structure for a heat radiation middle frame or a heat radiation rear case, the heat radiation middle frame or the heat radiation rear case and a manufacturing method of the heat radiation middle frame or the heat radiation rear case. According to the structure, an accommodating groove is formed in the middle frame or the rear case, the opening of the top of the accommodating groove is sealed by a heat radiation plate; the lower surface of the heat radiation plate is provided with an adsorption element used for adsorbing liquid; a support post used for preventing the heat radiation plate from sinking into the accommodating groove is arranged in the accommodating groove; the accommodating groove of the middle frame or the rear case forms a vacuum cavity with the heat radiation plate; heat absorption liquid capable of being evaporated is injected into the accommodated groove. The heat radiation middle frame or the heat radiation rear case of intelligent electronic equipment is directly used as a design carrier of the heat radiation structure; the vacuum cavity is formed by the arrangement of the accommodating groove and the heat radiation plate on the heat radiation middle frame or the heat radiation rear case; the support post is arranged in the vacuum cavity; the influence on the inside gas-liquid circulation by vacuum cavity space compression due to the heat radiation plate sinking during vacuum suction caused by vacuum pressure can be effectively prevented; meanwhile, the support post can further form the gas-liquid circulation passage; the gas-liquid efficient circulation is facilitated; the heat circulation radiation is accelerated.

Description

technical field [0001] The invention relates to the technical field of heat dissipation in electronic products, in particular to a structure for a heat dissipation middle frame or a heat dissipation rear case, a heat dissipation middle frame or a heat dissipation rear case and a manufacturing method. Background technique [0002] With the continuous innovation of smart electronic devices such as smartphones and tablet computers, especially with the continuous change of communication technology, the application of 5G communication is gradually promoted. Mobile phone manufacturers spare no effort in the pursuit of performance, one of the key is to continuously introduce more powerful processors, but if the processor heats up and the heat cannot be quickly discharged, based on the protection mechanism of the processor itself, it will automatically reduce the frequency to reduce Fever directly leads to a rapid decline in performance. The power consumption of the CPU of the inte...

Claims

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Application Information

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IPC IPC(8): H05K7/20H04M1/02
CPCH05K7/2039H04M1/026H05K7/2029
Inventor 许春华孙爱祥
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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