Structure for heat radiation middle frame or heat radiation rear case, heat radiation middle frame or heat radiation rear case and manufacturing method of heat radiation middle frame or heat radiation rear case

Abstract

The invention discloses a structure for a heat radiation middle frame or a heat radiation rear case, the heat radiation middle frame or the heat radiation rear case and a manufacturing method of the heat radiation middle frame or the heat radiation rear case. According to the structure, an accommodating groove is formed in the middle frame or the rear case, the opening of the top of the accommodating groove is sealed by a heat radiation plate; the lower surface of the heat radiation plate is provided with an adsorption element used for adsorbing liquid; a support post used for preventing the heat radiation plate from sinking into the accommodating groove is arranged in the accommodating groove; the accommodating groove of the middle frame or the rear case forms a vacuum cavity with the heat radiation plate; heat absorption liquid capable of being evaporated is injected into the accommodated groove. The heat radiation middle frame or the heat radiation rear case of intelligent electronic equipment is directly used as a design carrier of the heat radiation structure; the vacuum cavity is formed by the arrangement of the accommodating groove and the heat radiation plate on the heat radiation middle frame or the heat radiation rear case; the support post is arranged in the vacuum cavity; the influence on the inside gas-liquid circulation by vacuum cavity space compression due to the heat radiation plate sinking during vacuum suction caused by vacuum pressure can be effectively prevented; meanwhile, the support post can further form the gas-liquid circulation passage; the gas-liquid efficient circulation is facilitated; the heat circulation radiation is accelerated.

Description

technical field [0001] The invention relates to the technical field of heat dissipation in electronic products, in particular to a structure for a heat dissipation middle frame or a heat dissipation rear case, a heat dissipation middle frame or a heat dissipation rear case and a manufacturing method. Background technique [0002] With the continuous innovation of smart electronic devices such as smartphones and tablet computers, especially with the continuous change of communication technology, the application of 5G communication is gradually promoted. Mobile phone manufacturers spare no effort in the pursuit of performance, one of the key is to continuously introduce more powerful processors, but if the processor heats up and the heat cannot be quickly discharged, based on the protection mechanism of the processor itself, it will automatically reduce the frequency to reduce Fever directly leads to a rapid decline in performance. The power consumption of the CPU of the inte...

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Problems solved by technology

However, in practical applications, if the volatile liquid is sealed in the hollow sealing structure according to this patent document, it will be difficult to realize. Due to the thin thickness of the middle frame, the hollow sealing cavity is prone to deformation and damage, and is limited by the small thickness and design. Influenced by the design thinking of limited space, it is difficult for the liquid to effectively exert the heat dissipation effect of the gas-liquid change cycle in such a hollow and sealed structure

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