Method for laser-cutting glass covered with protective film

Abstract

The invention discloses a method for laser-cutting glass covered with a protective film. The method comprises the following steps of selecting a to-be-cut part on a coated glass plate; machining the to-be-cut part along a preset cutting trajectory in a laser ablation mode by a first laser so as to remove the protective film and reveal a reserved ultrafast laser invisible cutting channel; and adopting a second laser to perform invisible cutting on the glass along the reserved ultrafast laser invisible cutting channel. In the method, laser cutting is adopted to replace mechanical cutting in theprior art, the protective film is removed in the laser ablation mode by the first laser before the glass is cut, so that damage to the surface of the glass in the cutting process can be avoided, the scratch rate and the pollution rate of the glass surface can be reduced, and the production yield is improved; and when the glass is cut, the energy of the laser beam cuts the glass in a non-contact manner, so that debris, fragments and micro cracks can be prevented from being generated, the strength of cutting edges by the laser is higher than that of a traditional scribing and segmentation mode,and subsequent finish machining is not needed to be carried out.

Description

technical field [0001] The invention relates to the field of laser application technology, in particular to a method for laser cutting glass covered with a protective film. Background technique [0002] Carbide or diamond cutters are usually used in traditional coated glass cutting methods, and the cutting process is divided into two steps: the first step is to use a diamond tip or a carbide grinding wheel to create a crack on the surface of the glass; second The first step is to use mechanical means to separate the glass along the crack line. [0003] However, scoring and cutting using this method results in chips, chips and micro-cracks that reduce the strength of the cutting edge and require an additional cleaning step. [0004] Therefore, how to avoid the generation of debris, fragments and micro-cracks in the cutting process is a technical problem that those skilled in the art need to solve at present. Contents of the invention [0005] In view of this, the object o...

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Problems solved by technology

[0003] However, scoring and cutting using this method results in chips, chips and micro-cracks that weaken the cut edge and require an additional cleaning step

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