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Graphite heat sink and method of manufacturing the same

A manufacturing method and heat sink technology, applied in semiconductor/solid-state device manufacturing, indirect heat exchangers, heat exchanger fixation, etc., can solve problems such as inherent harmfulness, system failure, system performance, and reliability damage, and achieve light Measuring the effect of mechanical strength

Pending Publication Date: 2019-05-03
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, usually microprocessors, integrated circuits, and other high-performance electronic components only work effectively within a certain range of threshold temperatures
Excessive heat generated during the operation of electronic components is not only detrimental to its inherent performance, but also damages the performance and reliability of the overall system due to this heat, causing system failures

Method used

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  • Graphite heat sink and method of manufacturing the same
  • Graphite heat sink and method of manufacturing the same
  • Graphite heat sink and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0057]

[0058] Hereinafter, the graphite heat sink 101 according to Embodiment 1 will be described with reference to the drawings.

[0059] figure 1 It is a schematic diagram showing the configuration of the graphite heat sink 101 according to the first embodiment. Figure 2A to schematically show figure 1 A diagram of the bonding structure 100 of the graphite fin 102 and the fin base 103 in FIG. Figure 2B for Figure 2A An enlarged view of the details of the bonded structure 100 of FIG. It should be noted that, in the drawings, for the sake of convenience, the direction in which the graphite fin 102 is pressed into the fin base 103 is taken as the -z axis direction for illustration. In addition, the direction in which the fin base 103 extends is defined as the x-axis direction.

[0060] The graphite heat sink 101 includes a graphite fin 102 and a metal 103 press-fitted to a part of the surface of the graphite fin 102 .

[0061] Hereinafter, constituent members const...

Embodiment 1

[0085] The graphite heat sink 101 of Example 1 was manufactured as follows.

[0086] First, as the graphite fin 102, a pressurized laminate of highly oriented graphite having a length of 50 mm, a width of 50 mm, and a thickness of 0.2 mm was used. As a starting material, a graphite plate obtained by laminating a plurality of sheets of polyoxadiazole as a polymer film and firing and graphitizing while controlling pressure application was used. In addition, as the fin base 103 , an aluminum base having a square of 50 mm (□50 mm), a thickness of 5 mm, a groove depth of 2 mm, the number of grooves 8, and a pitch of 4 mm was used. In addition, aluminum was pressed into the graphite fin 102 with a pressing force of 15 t and a pressing amount of 0.06 mm (30%) during riveting to manufacture the graphite heat sink 101 . The performance of the produced graphite heat sink 101 was evaluated by a drop test and a thermal conductivity test before and after a vibration test.

[0087] In add...

Embodiment 2

[0089] In Example 2, a graphite heat sink was fabricated under substantially the same conditions as in Example 1 except that the aluminum press-in amount was set to 0.04 mm (20%).

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PUM

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Abstract

A graphite heat sink with light weight and high mechanical strength includes graphite fins and a metal press-fitted and fixed to a part of a surface of the graphite fin.

Description

technical field [0001] The present invention relates to a graphite heat sink capable of managing heat emitted from a heat source such as an electronic device and a method for manufacturing the same. Background technique [0002] As electronic equipment capable of operating at high processing speed and high frequency, small in size, and having more complex power conditions, there are microprocessors, electronic and electrical parts and integrated circuits of devices, etc., and high-output optical devices, etc. The development of these electronic devices has become more and more advanced, and there will be cases where extremely high temperatures are generated. However, typically microprocessors, integrated circuits, and other high performance electronic components only operate effectively within a certain range of threshold temperatures. Excessive heat generated during the operation of electronic components is not only detrimental to its intrinsic performance, but also may da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L21/48
CPCF28D2021/0029H01L23/3672H01L23/373H01L23/3736H01L23/3737H01L23/4006H01L23/467H01L21/4882F28F21/02F28F3/06F28F2275/10
Inventor 桑原凉西木直巳森将人西川刚史
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD