Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
一种柔性印刷、电路板的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决高频信号损失、低介电常数、柔性印刷电路板制造成本增加等问题，达到防止高频信号的损失、介电损耗最小化的效果
Active Publication Date: 2019-05-03
AMOSENSE
View PDF8 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] However, there is a problem that when high-frequency signals are transmitted by using a flexible printed circuit board made of polyimide film, the dielectric loss inherent in the material causes signal loss of high-frequency signals
[0006] That is to say, there is a problem that the polyimide film has a high dielectric constant, so dielectric loss occurs during transmission and reception of high-frequency signals to cause loss of high-frequency signals, thereby causing problems in use such as video calls, Services for watching movies and streaming are disconnected
[0007] In addition, there is a problem that although a flexible printed circuit board made of a film with a low dielectric constant can minimize the loss of high-frequency signals, the heat resistance decreases due to low melting temperature, making the surface In surface mount technology (SMT) for high-frequency mounting components, it melts and malfunctions due to high temperatures of about 250°C
[0008] In addition, there is a problem that the price of a film having a low dielectric constant and high heat resistance is high, so that the manufacturing cost of the flexible printed circuit board increases, thereby losing market power
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0048] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains can easily practice the technical idea of the present disclosure. First, when adding reference numerals to components in each drawing, it should be noted that the same components are denoted by the same reference numerals even if they are shown in different drawings. Also, in the following description of the present disclosure, if a detailed description of a known configuration or function may obscure the gist of the present disclosure, the detailed description will be omitted.
[0049] see Figure 1 to Figure 3 , a method for manufacturing a flexible printed circuit board according to a first embodiment of the present disclosure includes: preparing a substrate 110S110, preparing an adhesive sheet 120S120, preparing a heat-resistant sheet 130S130, laminating the substrate 110,...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention provides a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by same, wherein dielectric loss caused by a high frequencysignal is minimized and loss of the high frequency signal is prevented by laminating a base sheet and an adhesion sheet, which have a low dielectric constant, and laminating on the topmost portion and the bottommost portion, a heat resistant sheet having heat resistance. The provided method for manufacturing a flexible printed circuit board includes of: a step for preparing a base sheet, a step for preparing an adhesion sheet having a melting temperature less than that of the base sheet, a step for preparing a heat resistant sheet having a melting temperature equal to or greater than that ofthe adhesion sheet, and a step for forming a laminate by laminating the base sheet, the adhesion sheet, and the heat resistant sheet, and a step for attaching the laminate by heating and pressing thelaminate.
Description
technical field [0001] The present disclosure relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by the method, and more particularly, to a method for manufacturing a flexible printed circuit board used as a circuit using a high frequency and the method for manufacturing a flexible printed circuit board by Flexible printed circuit boards manufactured by this method. Background technique [0002] In general, a flexible printed circuit board is a board that can be flexibly bent by forming a circuit pattern on a thin insulating film, and is widely used in portable electronic devices and automation machines, display products, or requires bending and flexibility when used by being installed in them similar devices. [0003] Flexible printed circuit boards are manufactured by adhering or die-casting copper foil onto polyimide (PI) film. At this time, polyimide films are widely used as substrates for flexible p...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02H05K1/03H05K3/32H05K3/42
CPCH05K1/0201H05K1/024H05K1/0313H05K1/0393H05K3/323H05K3/429H05K3/4635H05K3/4688H05K2201/0141H05K2201/0154H05K2201/0158H05K1/0237H05K1/0296H05K1/0277H05K1/036H05K3/0011H05K3/06H05K3/422H05K3/423H05K3/4644
Inventor 段成伯
Owner AMOSENSE
Features
- R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
Why Patsnap Eureka
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com