Electric field traction type hard and brittle material ultrafast laser heat cracking processing device and method

A technology of ultra-fast laser and hard and brittle materials, which is applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of insufficient depth of ultra-fast laser thermal cracking and extended crack depth, etc., and achieve less fragments and less roughness Effect of small, debris-free slag burrs

Active Publication Date: 2019-05-10
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides an electric field traction ultrafast laser thermal cracking processing device and method, the purpose of which is to first excite free electrons by the energy provided by the ultrafast laser, and then The electric field pulls the free electrons to move in a deeper direction, thereby realizing the thermal stress excitation deep in the material and extending the crack depth, thus solving the technical problem of insufficient depth of ultrafast laser thermal cracking in the prior art

Method used

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  • Electric field traction type hard and brittle material ultrafast laser heat cracking processing device and method
  • Electric field traction type hard and brittle material ultrafast laser heat cracking processing device and method

Examples

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example 1

[0033] 【Example 1】Workpiece processing of glass material, thickness 2mm, electro-acoustic coupling time > 20ps

[0034] Step 1: Device Arrangement:

[0035] The cathode plate 3 and the laser head 2 are arranged above the workpiece 5 to be processed on the front of the insulating support plate 6, and the anode plate 8 is located on the back of the insulating support plate 6 and faces the cathode plate 3; adjust the position of the laser head 2 or the cathode plate 3 so that the laser head 2 is always located directly in front of the cathode plate 3 on the processing path, and the laser beam is located at the edge of the cathode plate 3.

[0036] Step 2: Parameter setting:

[0037] Ultrafast laser process parameters: power 50W, wavelength 355nm, pulse width 10ps, repetition frequency 50kHz, focus on the material surface;

[0038] Electric field parameters: adjust the distance between the cathode plate 3 and the anode plate 8 to 0.5cm, and the voltage output by the voltage sour...

example 2

[0042] [Example 2] Workpiece processing of sapphire material, thickness 3mm, electro-acoustic coupling time > 80ps

[0043] Step 1: Device Arrangement:

[0044] The cathode plate 3 and the laser head 2 are arranged above the workpiece 5 to be processed on the front of the insulating support plate 6, and the anode plate 8 is located on the back of the insulating support plate 6 and faces the cathode plate 3; adjust the position of the laser head 2 or the cathode plate 3 so that the laser head 2 is always located directly in front of the cathode plate 3 on the processing path, and the laser beam is located at the edge of the cathode plate 3.

[0045] Step 2: Parameter setting:

[0046] Ultrafast laser process parameters: power 100W, wavelength 532nm, pulse width 70ps, repetition frequency 200kHz, focus on the material surface;

[0047] Electric field parameters: adjust the distance between the cathode plate 3 and the anode plate 8 to 1cm, and the voltage output by the voltage ...

example 3

[0051] [Example 3] Workpiece processing of ceramic materials, thickness 5mm, electro-acoustic coupling time > 200ps

[0052] Step 1: Device Arrangement:

[0053] The cathode plate 3 and the laser head 2 are arranged above the workpiece 5 to be processed on the front of the insulating support plate 6, and the anode plate 8 is located on the back of the insulating support plate 6 and faces the cathode plate 3; adjust the position of the laser head 2 or the cathode plate 3 so that the laser head 2 is always located directly in front of the cathode plate 3 on the processing path, and the laser beam is located at the edge of the cathode plate 3.

[0054] Step 2: Parameter setting:

[0055] Ultrafast laser process parameters: power 200W, wavelength 1064nm, pulse width 180ps, repetition frequency 450kHz, focus on the material surface;

[0056] Electric field parameters: adjust the distance between the cathode plate 3 and the anode plate 8 to 4cm, and the voltage output by the volta...

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Abstract

The invention discloses an electric field traction type hard and brittle material ultrafast laser heat cracking processing device and method, and belongs to the field of hard and brittle material laser processing. According to the device and the method, a longitudinal electric field is additionally provided on the basis of ultrafast laser heat cracking processing, then heat cracking processing depth is expanded, by setting reasonable ultrafast laser heat cracking processing technological parameters, correctly arranging a positive pole and a negative pole of an electrode, controlling a laser head and the electrode to synchronously move for processing and setting optimal electrode distance and voltage, ultrafast laser heat cracking processing of a thick plate hard and brittle material is achieved, and processing capability, quality and efficiency of the hard and brittle material are improved.

Description

technical field [0001] The invention belongs to the field of laser processing of hard and brittle materials, and more particularly relates to a method for hard and brittle materials, especially a laser thermal cracking processing method, which adopts ultra-fast pulse laser processing and external electric field traction to expand the crack depth. Background technique [0002] For hard and brittle materials, traditional contact processing methods have poor stability, heavy pollution, and low efficiency. It is urgent to develop advanced non-contact processing methods. Laser processing is favored in non-contact processing because of its flexibility, simple structure, and high efficiency. Among the existing laser light sources, continuous light and long-pulse lasers have large heat-affected zones and high temperature gradients, and generate a large number of thermal cracks with random directions and uncontrollable directions. processing. There are two types of "micro-explosion...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36
Inventor 吴寒马修泉张聪李扬威
Owner HUAZHONG UNIV OF SCI & TECH
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