GaN-based HEMT device and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- PEKING UNIV SHENZHEN GRADUATE SCHOOL
- Publication Date
- 2019-05-10
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor device manufacturing, in particular to a GaN-based HEMT device and a preparation method thereof. Background technique
[0002] Power devices featuring low power consumption and high speed have recently attracted a lot of attention as the need for efficient and complete power conversion circuits and systems has increased. Wide bandgap semiconductor gallium nitride GaN material has the characteristics of large bandgap width, high critical breakdown electric field, and high electron saturation velocity, and has become an ideal material for a new generation of semiconductor power devices. In recent years, GaN-based HEMT devices represented by Al(ln, Ga, Sc)N / GaN can improve the safety of circuit operation. GaN-based HEMT devices are normally-on devices. In circuits, power elements of the normally-off type, also known as enhancement-mode (e-mode) transistors, are preferred for fail-safe operation. To re...