Lead frame for highly integrated frequency converter

Abstract

The invention relates to a lead frame for a highly integrated frequency converter. The lead frame comprises a carrier substrate, lead pins and lead pin columns, wherein a plurality of lead pins are integrally and uniformly distributed around the carrier substrate; a middle circular indentation groove and a circle of more than four peripheral quadrilateral indentation grooves uniformly distributedaround the middle circular indentation groove are formed on the plurality of lead pins by stamping to crimp the lead pin columns, and the lead pins are coated with a gold foil layer; a plurality of circles of circumferential notches are arranged in the area between the carrier substrate and the lead pins, and an MS0408 copper protective agent layer is coated on the area. The lead frame is simple in structure, and can effectively take into account the properties of stable use, excellent contact, oxidation resistance, long service life, safety and the like.

Description

technical field [0001] The invention relates to a lead frame, in particular to a lead frame for a highly integrated frequency converter. Background technique [0002] The lead frame is a key structural component used as an integrated circuit chip carrier, and uses metal wires to make the internal circuit leads of the chip electrically connected to the external leads through the inner leads to form an electrical circuit. In semiconductors, the lead frame mainly plays the role of stabilizing the chip, conducting signals, and transferring heat. For some highly integrated electronic components, such as inverters, the use of lead frames requires high structure and connection conduction performance. The traditional base, upper and lower ribs and pin structures have the following disadvantages, which cannot meet the needs of stable chips. Function, the use of soldered lead pin structure is prone to false welding, resulting in poor contact between the final chip and the lead. Long-...

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