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Enclosure system including wire mesh and thin non-porous membrane panels

A package and panel technology, which is applied to the components, pump components, electrical components, etc. of the pumping device for elastic fluid, can solve the problems of increasing capital cost, and achieve the effect of suppressing unintentional discharge

Active Publication Date: 2019-05-21
EDWARDS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such measures not only make it difficult for personnel to open and remove doors to service equipment contained in the enclosure, but can also add significant capital costs to the equipment

Method used

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  • Enclosure system including wire mesh and thin non-porous membrane panels
  • Enclosure system including wire mesh and thin non-porous membrane panels
  • Enclosure system including wire mesh and thin non-porous membrane panels

Examples

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Embodiment Construction

[0031] figure 1 A wrapping element system 2 according to the invention is illustrated. The enclosure system 2 is configured to enclose one or more pieces of equipment. The equipment represents a collection of equipment located downstream of a semiconductor processing chamber that, in operation, receives harsh process gases from the semiconductor processing chamber. The process gas includes unused precursor gases and by-products formed during processing within the chamber. In this example, the rear chamber equipment 4 comprises a vacuum pump 6 connected via a conduit 10 to an abatement unit 8 . One or more valves (not shown) will also be incorporated into the equipment 4 . The equipment is in fluid communication with a processing chamber (eg, an epitaxy chamber (not shown)) via another conduit or foreline (not shown).

[0032] The enclosure system 2 comprises a metal frame 12 configured to describe an outer enclosure surrounding the workspace of the back room equipment 4 . ...

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Abstract

The present invention is an enclosure system formed of a lightweight panel with a thin non-porous membrane that enables the extraction and leak detection of hazardous gases from housing equipment suchas vacuum pumps, valves, abatement equipment and the like. Additionally, the enclosure system includes a one or multiple layers of wire mesh which prevent projectiles with a high kinetic energy fromescaping from the housing equipment thereby minimising the risk of an explosion causing parts or panels to be ejected from the enclosure system.

Description

technical field [0001] This invention relates to the protection of personnel and equipment from injury and damage from projectile and hazardous gas leaks due to failure of vacuum pumps, valves or abatement equipment. Background technique [0002] The deposition steps of semiconductor wafer processing employ a variety of precursor gases. These gases are often used ineffectively in the process, and any unused precursors and process by-products are pumped out of the chamber by a vacuum pump. [0003] As the precursors and process by-products are pumped out of the chamber, they continue to react and / or deposit solids within the vacuum and / or abatement system. In particular, deposits can form in the dead volume of the vacuum pump used to transport the gas away from the chamber, as well as in the exhaust line and within the abatement equipment through which the gas passes. [0004] Maintenance of semiconductor processing chambers or vacuum and / or abatement systems is generally p...

Claims

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Application Information

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IPC IPC(8): F04D17/16F04D19/04F04D27/02F04D29/60F42D5/045
CPCF04C25/02F04D17/168F04D19/04F41H5/0457F42D5/045F04C28/28H01L21/67017H01L21/67253H01L21/67276E04B1/92
Inventor M.W.格雷
Owner EDWARDS LTD
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