Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer carrier and metal organic chemical vapor deposition equipment

A metal organic chemistry and vapor deposition technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problem of affecting the wavelength uniformity of the wafer, and achieve the goal of improving airflow interference and improving wavelength uniformity. Effect

Active Publication Date: 2021-10-22
PLAYNITRIDE DISPLAY CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the distance between adjacent wafers is too close, it is easy to affect the wavelength uniformity of the wafers (wavelength uniformity)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer carrier and metal organic chemical vapor deposition equipment
  • Wafer carrier and metal organic chemical vapor deposition equipment
  • Wafer carrier and metal organic chemical vapor deposition equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The technical content, features and effects of the present invention will be clearly presented in the following detailed descriptions of the embodiments with accompanying drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in any of the following embodiments, the same or similar elements will be given the same or similar symbols.

[0050] The wafer carrier in any of the following embodiments can be applied to metal organic chemical vapor deposition equipment. In the metal organic chemical vapor deposition process, the wafer carrier is used to carry a plurality of wafers to be processed. Wafer carriers can be formed from any material that can withstand processing temperatures. For example, the material of the wafer carrier can be graphi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wafer carrier, which includes a rotation axis, a central flat area, a wafer setting area and a plurality of wafer accommodation slots. The axis of rotation passes through the center of the central flat zone. A wafer setup area surrounds the central planar area. A plurality of wafer accommodation slots are arranged in the wafer installation area. The diameter of each wafer accommodating groove is D, and the radius of the central flat area is 0.5D˜3D. The surface of the central flat area is a flat plane. Also provided is a wafer carrier and metal-organic chemical vapor deposition equipment using any one of the above two wafer carriers.

Description

technical field [0001] The invention relates to a carrier plate and equipment, in particular to a wafer carrier plate and metal organic chemical vapor deposition equipment. Background technique [0002] Metal Organic Chemical Vapor Deposition (MOCVD) is currently a method for epitaxy on wafers. During MOCVD, a wafer is placed on a wafer carrier. The desired crystal growth is obtained by controlling processing parameters such as temperature, gas pressure and gas flow rate in the chamber. Based on throughput considerations, as many wafers as possible are usually placed on the wafer carrier. However, if the distance between adjacent wafers is too short, the wavelength uniformity of the wafers will be easily affected. Contents of the invention [0003] The invention provides a wafer carrier, which can improve the wavelength uniformity. [0004] The present invention provides a metal organic chemical vapor deposition equipment, which uses the above-mentioned wafer carrier. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/458C23C16/455
Inventor 王信介赖彦霖吴俊德严千智
Owner PLAYNITRIDE DISPLAY CO LTD