Microwave receiving and transmitting assembly

A technology for transmitting and receiving components and microwaves, which is applied in the direction of electrical components, printed circuit components, and electrical connection printed components, etc. It can solve problems such as failure of microwave and millimeter wave components, high transportation and use costs, and weak joint force capacity. Achieve miniaturized design, compact structure, and weight reduction

Active Publication Date: 2019-05-24
西安茂德通讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing microwave and millimeter wave components in the form of multi-module combination are mostly 19-inch chassis and large-scale modular systems. The microwave modules in the microwave and millimeter wave components composed of modules are generally connected in the form of joint butt joints. This connection method is prone to problems such as poor radio frequency index and weak joint force capacity, which leads to the failure of the entire microwave and millimeter wave components. error occured

Method used

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  • Microwave receiving and transmitting assembly
  • Microwave receiving and transmitting assembly
  • Microwave receiving and transmitting assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] see Figure 1 to Figure 5 , in this embodiment, a microwave transceiver assembly includes a housing 1, a receiving input module, a receiving and output circuit board 3, a waveform output circuit board 4, a signal distribution circuit module, and a power supply and control circuit board 6, the housing 1 The top surface of the casing 1 is provided with a first groove and a second groove, the bottom surface of the housing 1 is provided with a third groove and a fourth groove, and the receiving input module and the receiving output circuit board 3 are arranged in the first concave Groove, the first groove is provided with a first receiving input interface 21, a second receiving input interface 22, a third receiving input interface 23 and a transmitting output interface 24 in order from left to right on the groove wall on one side of the receiving input module. A groove is provided with a first receiving output interface 31, a second receiving output interface 32, a third re...

Embodiment 2

[0033] On the basis of Embodiment 1, the receiving input circuit board 27 , the receiving output circuit board 3 , the waveform output circuit board 4 and the signal distribution circuit module of the receiving input module are all provided with bare chip hollowed out parts.

[0034] In this embodiment, the volume of the chip after packaging is relatively large, and the circuit board carrying the chip also needs to leave space for the chip, so that the volume and quality of the circuit board itself are relatively large, so the direct connection between the bare chip and the circuit board is adopted. The design method can greatly save the occupied area of ​​the circuit board and realize the miniaturization design of the circuit board.

Embodiment 3

[0036]On the basis of Embodiment 2, the groove bottoms of the first groove, the second groove and the third groove correspond to the receiving input module, the receiving output circuit board 3, the waveform output circuit board 4 and the signal distribution circuit module The hollowed out parts of the heat sink are respectively provided with heat sink grooves, and each heat sink groove is provided with a heat sink 11, and each heat sink 11 is provided with a bare chip 12, and the projected area of ​​the heat sink 11 is larger than the projected area of ​​the bare chip 12 .

[0037] In this embodiment, in order to fix the bare chip conveniently, the bare chip is welded on the heat sink, which can effectively fix the bare chip, and can conduct the heat emitted by the chip to the shell in time, and the size of the heat sink is smaller than that of the bare chip. The size is about tens of microns larger, which greatly reduces the occupied area of ​​the chip, and the heat sink is ...

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Abstract

The invention provides a microwave receiving and transmitting assembly, which comprises a shell, a receiving input module, a receiving output circuit board, a waveform output circuit board, a signal distribution circuit module and a power supply and control circuit board. The receiving input module, the receiving output circuit board and the waveform output circuit board are arranged in a groove in the top surface of the shell. The signal distribution circuit module and the power supply and control circuit board are arranged in a groove in the bottom surface of the shell. According to the invention, the microwave receiving and transmitting assembly is compact in structure and high in integration level. According to the invention, a plurality of microwave signal channels are physically isolated by means of the shell, division bars and cover plates of the assembly. Meanwhile, isolation indicators are added, and the signal crosstalk is reduced. All modules are connected in a welding mode.The connection reliability of between modules is guaranteed. In addition, a bare chip and a circuit board are connected through the gold wire bonding technology. The size of the circuit board is further reduced. The overall size of the microwave receiving and transmitting assembly is reduced. The miniaturization design of the microwave receiving and transmitting assembly is achieved.

Description

technical field [0001] The invention relates to the technical field of microwave transceiver components, in particular to a microwave transceiver component. Background technique [0002] The existing microwave and millimeter wave components in the form of multi-module combination are mostly 19-inch chassis and large-scale modular systems. The microwave modules in the microwave and millimeter wave components composed of modules are generally connected in the form of joint butt joints. This connection method is prone to problems such as poor radio frequency index and weak joint force capacity, which leads to the failure of the entire microwave and millimeter wave components. error occured. [0003] With the development of the microwave industry, the industry has put forward higher requirements for the miniaturization design of microwave devices. For example, in the field of satellites and radars, satellite systems can be equipped with miniaturized designs to reduce the occupa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/14H05K1/18H05K1/11H04B1/40
Inventor 钟意屈平冯维星董伟强韩万收
Owner 西安茂德通讯科技有限公司
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