Siloxane epoxide containing a plurality of silylphenyl or isomer thereof, and applications thereof

Abstract

The present invention discloses a siloxane epoxide containing a plurality of silylphenyl or an isomer thereof, wherein the structure of the siloxane epoxide is represented by the following formula defined in the specification. The present invention further discloses a curable organosilicon composition, which contains the siloxane epoxide containing a plurality of silylphenyl and / or the isomers thereof. According to the present invention, with the application of the siloxane epoxide containing a plurality of silylphenyl or the isomer thereof as the cross-linking agent for hydrosilylation reactions, the siloxane epoxide has advantages of high refractive index, high viscosity, high cross-linking density and the like compared with the existing cross-linking agents; and the organosilicon composition containing the siloxane epoxide or the isomers thereof has characteristics of high curing efficiency, high hardness after curing, high refractive index, low thermal weight loss, good toughness and the like, and is suitable for packaging, bonding, surface protection and other fields of various electronic devices, semiconductor optoelectronic devices and the like.

Description

technical field [0001] In particular, the present invention relates to a siloxane epoxide containing multiple silylphenyl groups and / or isomers thereof, a curable silicone compound comprising said siloxane epoxide and / or isomers thereof Compositions, etc., which can be applied to the packaging fields of semiconductor devices such as light emitting diodes (LEDs) and electronic devices. Background technique [0002] LED (Semiconductor Light Emitting Diode) is widely used in lighting, backlighting and other fields due to its advantages of low energy consumption, long life, small size and the like. The packaging process is a very important process in the LED manufacturing process, which has a very significant impact on the performance and cost of the LED. [0003] With the development of semiconductor devices, the performance requirements for packaging adhesives are gradually increasing. For example, as the power and brightness of light-emitting diodes (LEDs) continue to incre...

AI Technical Summary

Problems solved by technology

However, existing cross-linking agents still have some insurmountable defects

For example, silicone encapsulants using existing crosslinking agents usually have defects such as slow curing speed, long curing time, low hardness, low refractive index, and low toughness of the cured silicone encapsulant. Therefore, When applied to the packaging of LEDs, etc., it often affects its light extraction efficiency, light quality, uniformity of light color, device reliability, etc.

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