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A kind of release film, preparation method of flexible device, release film and flexible device

A flexible device and release film technology, applied in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of uneasy discharge of static charge, electrostatic breakdown damage of thin-film transistors, etc., to improve electrostatic discharge capacity, The effect of reducing the difficulty of peeling

Active Publication Date: 2021-10-01
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The release layer made of this polymer material has insulating properties, and the static charge accumulated in the electronic or optical device is not easy to release, and the static charge is easy to cause electrostatic breakdown damage to the thin film transistor

Method used

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  • A kind of release film, preparation method of flexible device, release film and flexible device
  • A kind of release film, preparation method of flexible device, release film and flexible device
  • A kind of release film, preparation method of flexible device, release film and flexible device

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preparation example Construction

[0024] figure 1 A schematic flow chart of a method for preparing a release film provided by an embodiment of the present invention is exemplarily shown. like figure 1 Shown, this release film preparation method comprises the following steps:

[0025] Step 101: coating a mixed solution including metal nanoparticles and carbon nanomaterials with hydrophilic groups on a glass substrate;

[0026] Step 102: heating and drying the mixed solution on the glass substrate to obtain a release film attached to the glass substrate.

[0027] In the embodiment of the present invention, a mixed solution including metal nanoparticles and carbon nanomaterials with hydrophilic groups is coated on the glass substrate; the mixed solution on the glass substrate is heated and dried to obtain a release form attached to the glass substrate membrane. In this way, on the one hand, due to the weak hydrophilicity of carbon nanomaterials with hydrophilic groups, they can form chemical bonds with the hy...

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Abstract

The embodiment of the present invention relates to the technical field of flexible device manufacturing, in particular to a release film, a method for preparing a flexible device, a release film and a flexible device, so as to reduce the difficulty of peeling the release film from the glass substrate and improve the strength of the release film. Electrostatic discharge capability. In the embodiment of the present invention, a mixed solution comprising metal nanoparticles and carbon nanomaterials with hydrophilic groups is coated on the glass substrate; the mixed solution on the glass substrate is heated and dried to obtain a release film attached to the glass substrate . In this way, the release layer formed by the mixed solution of carbon nanomaterials with hydrophilic groups and metal nanoparticles has a certain bonding force with the surface of the glass substrate, but compared with the polymer release film in the prior art The bonding force with glass is weak, which can reduce the difficulty of peeling off the release film from the glass substrate; and the metal nanoparticles are conductive, which can improve the electrostatic discharge ability of the release film.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of flexible device manufacturing, in particular to a release film, a method for preparing a flexible device, a release film and a flexible device. Background technique [0002] In the manufacturing process of flexible devices, polymer precursors are often coated and cured on glass substrates to form flexible substrates, and electronic and optical devices are fabricated on flexible substrates. After the subsequent electronic and optical device manufacturing processes are completed, the glass substrate is removed by laser irradiation (LLO, Laser Lift-off for short) to obtain a flexible device. [0003] In the prior art, since the flexible substrate and electronic devices are easily damaged when LLO is used to peel off the glass substrate, a release layer made of polymer material is generally introduced between the glass substrate and the flexible substrate, and the glass substrate is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D1/00C09D5/24H01L51/56
Inventor 王历平
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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