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Non-resistance flexible lamp strip circuit structure based on conductive paste and preparation technology

A technology of flexible light strips and circuit structures, which is applied in circuit layout, lighting and heating equipment, lighting device components, etc., can solve problems such as low product production efficiency and pass rate, complex flexible circuit structure, and complex production process. Achieve the effects of low production cost, simple structure and production process, and improved operating performance

Inactive Publication Date: 2019-06-07
河南博美通电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the cost and progress of flexible circuit board production technology, it is widely used in electronic products, lighting equipment and other equipment, but in actual use, it is found that the currently used flexible circuit boards are often based on PI or PET flexible films. The traditional structure of copper foil circuit is prepared on the surface of PI or PET flexible film by bonding adhesives such as conductive adhesive or directly by printing. Need, often all need to weld a large number of resistance devices of different parameter types on the copper foil circuit, although it can meet the needs of use, but on the one hand, the current flexible circuit structure is complicated, and the production cost is relatively high. On the other hand, it also causes Due to the complex production process, high production difficulty, and relatively low production efficiency and pass rate, it is difficult to effectively meet the needs of actual use

Method used

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  • Non-resistance flexible lamp strip circuit structure based on conductive paste and preparation technology
  • Non-resistance flexible lamp strip circuit structure based on conductive paste and preparation technology
  • Non-resistance flexible lamp strip circuit structure based on conductive paste and preparation technology

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Experimental program
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Effect test

Embodiment 1

[0034] like image 3 As shown, a preparation process of a non-resistance flexible light strip circuit structure based on conductive paste includes the following steps:

[0035] S1, substrate pretreatment, firstly clean and dry the substrate surface of the flexible insulating film to be processed in a dust-free environment for standby;

[0036]S2, circuit design, according to parameters such as the structure of electrical appliances on each circuit on the circuit board, operating voltage, resistance, etc., set each data parameter based on the electric plasma circuit including the specific number, wiring structure and resistance value parameter content of the electric paste circuit;

[0037] S3, circuit assembly, after completing step S1, the conductive paste is first transported to the screen printing equipment for standby, and the flexible insulating film substrate is transferred to the workbench of the screen printing equipment, and then the conductive paste based on the cond...

Embodiment 2

[0044] like image 3 As shown, a preparation process of a non-resistance flexible light strip circuit structure based on conductive paste includes the following steps:

[0045] S1, substrate pretreatment, firstly clean and dry the substrate surface of the flexible insulating film to be processed in a dust-free environment for standby;

[0046] S2, circuit design, according to parameters such as the structure of electrical appliances on each circuit on the circuit board, operating voltage, resistance, etc., set each data parameter based on the electric plasma circuit including the specific number, wiring structure and resistance value parameter content of the electric paste circuit;

[0047] S3, circuit assembly, after completing step S1, the conductive paste is first transported to the screen printing equipment for standby, and the flexible insulating film substrate is transferred to the workbench of the screen printing equipment, and then the conductive paste based on the con...

Embodiment 3

[0054] like image 3 As shown, a preparation process of a non-resistance flexible light strip circuit structure based on conductive paste includes the following steps:

[0055] S1, substrate pretreatment, firstly clean and dry the substrate surface of the flexible insulating film to be processed in a dust-free environment for standby;

[0056] S2, circuit design, according to parameters such as the structure of electrical appliances on each circuit on the circuit board, operating voltage, resistance, etc., set each data parameter based on the electric plasma circuit including the specific number, wiring structure and resistance value parameter content of the electric paste circuit;

[0057] S3, circuit assembly, after completing step S1, the conductive paste is first transported to the screen printing equipment for standby, and the flexible insulating film substrate is transferred to the workbench of the screen printing equipment, and then the conductive paste based on the con...

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Abstract

The invention relates to a non-resistance flexible lamp strip circuit structure based on conductive paste. The non-resistance flexible lamp strip circuit structure comprises a flexible insulating filmsubstrate, a conductive paste based circuit and an insulating white oil layer, wherein at least one conductive paste based circuit is arranged, wraps the outer surface of the flexible insulating filmsubstrate and is parallel to the flexible insulating film substrate. The insulating white oil layer wraps the outer surface of the flexible insulating film substrate and the outer surface of the conductive paste based circuit separately. A preparation technology comprises five steps of substrate pretreatment, circuit design, circuit assembly, drying and curing and insulation treatment. On the onehand, the structure and the production process are simple, the production cost is low, and the conductive performance, the insulating property and the flame retardancy are good. On the other hand, compared with a traditional flexible circuit board, resistance equipment is effectively omitted, so that the production process difficulty and cost of the flexible circuit board are reduced, the production efficiency and the product percent of pass are greatly improved, then the operation performance of the flexible circuit board is greatly improved, and the use and production cost is reduced.

Description

technical field [0001] The invention relates to a circuit structure and preparation process of a non-resistance flexible lamp strip based on conductive paste, which belongs to the technical field of flexible circuit boards. Background technique [0002] With the cost and progress of flexible circuit board production technology, it is widely used in electronic products, lighting equipment and other equipment, but in actual use, it is found that the currently used flexible circuit boards are often based on PI or PET flexible films. The traditional structure of copper foil circuit is prepared on the surface of PI or PET flexible film by bonding adhesives such as conductive adhesive or directly by printing. Need, often all need to weld a large number of resistance devices of different parameter types on the copper foil circuit, although it can meet the needs of use, but on the one hand, the current flexible circuit structure is complicated, and the production cost is relatively ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V23/00F21Y115/10
Inventor 辛凤高
Owner 河南博美通电子科技有限公司