Silicon wafer CMP post-processing equipment and processing flow

Abstract

The invention relates to silicon wafer CMP post-processing equipment and a processing flow. The silicon wafer CMP post-processing equipment comprises an ozone water tank and a pure water flushing tank, wherein the ozone water tank and the pure water flushing tank are located at the rear ends of a plurality of CMP processing devices; a mechanical arm; a CMP post-cleaning device, wherein a water tank for placing a silicon wafer storage box is arranged at the front end of the CMP post-cleaning device. The processing method comprises the following steps: 1, processing silicon wafers by the CMP processing devices, and putting the silicon wafers into the silicon wafer storage box located in the ozone water tank of the CMP processing devices; 2, putting the silicon wafer storage box at the firststep in the pure water flushing tank for flushing; 3, delivering the silicon wafer storage box in the pure water flushing tank at the rear ends of the CMP processing devices to the water tank at the front end of the CMP post-cleaning device through the mechanical arm; 4, cleaning the silicon wafers in the silicon wafer storage box in the water tank one by one by the CMP post-cleaning device by using a CMP post-cleaning process. The method has the following advantages: (1) the silicon wafers are in a wet state in the whole process, and the cleaning precision of the silicon wafers is high; (2) the cleaning process effect of the silicon wafers after CMP is good.

Description

technical field [0001] The invention belongs to the related field of silicon wafer production and processing, and in particular relates to a silicon wafer CMP post-processing equipment and a processing flow. Background technique [0002] In the existing semiconductor manufacturing process, in order to better meet the high requirements of photolithography for planarization, chemical mechanical polishing process, that is, CMP has been widely used in deep submicron technology (<0.25um). [0003] In the CMP production and processing of silicon wafers, it is first necessary to perform CMP processing on the silicon wafers, and then to perform subsequent cleaning and processing on the silicon wafers, so as to ensure the high precision requirements of the silicon wafers. [0004] However, in the existing CMP production and processing of silicon wafers, either a single wafer of silicon wafers is transported by a robot, so that the production capacity is low and cannot meet the act...

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Problems solved by technology

[0004] However, in the existing CMP production and processing of silicon wafers, either a single wafer of silicon wafers is transported by a robot, so that the production capacity is low and cannot meet the actual production and processing needs; or a box of silicon wafers is manually processed. Although the silicon wafers are always in ozone water at this time, which can ensure that the silicon wafers are in a wet state, the manual handling method leads to high labor intensity and cannot further improve production efficiency; at the same time, the cleaning of silicon wafers after CMP In the process, the cleaning effect is not thorough, and the particles, organic matter and SiO on the silicon wafer cannot be removed 2 removal, and thus cannot guarantee the high-precision requirements of silicon wafer production

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