Method for solving antenna effect of cooling fin

Abstract

The invention relates to the technical field of electronics and particularly relates to a method for solving antenna effect of a cooling fin. The method comprises the steps of S1, providing an integrated chip and setting a heat conduction layer and a metal cooling fin on the integrated chip in sequence; and S2, adjusting thickness of the heat conduction layer to be unequal to a preset value, thereby reducing the antenna effect of the metal cooling fin. The technical scheme provided by the invention has the beneficial effects that an electromagnet interference method for solving the antenna effect is disclosed; the thickness of the heat conduction layer is adjusted to be unequal to the preset value, so the antenna effect of the metal cooling fin is reduced; a designer is assisted to designan H-shaped heat sink with low radiation; and an engineer is assisted to analyze an EMI (Electromagnet Interference) radiation problem of an electronic product.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a method for solving the antenna effect of a heat sink. Background technique [0002] With the development of the electronics industry, the signal transmission rate of electronic equipment is getting higher and higher. For example, the 4K display interface on the market adopts the high-speed serial interface "V-By-One" mode transmission, and its data transmission rate has reached 2.97GHz , the electromagnetic interference (EMI, Electromagnet integrated chip Interference) radiation caused by this is particularly prominent. Moreover, in systems with ever-improving performance, the heat dissipation of the processing system is becoming more and more difficult. In order to ensure the safe and stable operation of the equipment, using metal heat sinks to dissipate heat for integrated chips has become the mainstream choice in the industry, but the introduction of improperly designed ...

AI Technical Summary

Problems solved by technology

Moreover, in systems with ever-improving performance, the heat dissipation of the processing system is becoming more and more difficult. In order to ensure the safe and stable operation of the equipment, using metal heat sinks to dissipate heat for integrated chips has become the mainstream choice in the industry, but the introduction of improperly designed The metal heat sink will make the high-frequency signal in the system, such as the 2.97GHz radiation problem of the high-speed serial interface "V-By-One", the radiation problem is particularly serious, which significantly increases the product development cost and production cost

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