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High-filling-ratio loop thermosiphon based on multi-scale synergistic hydrophobic surface

A technology with hydrophobic surface and high liquid filling rate. It is used in heat transfer modification, heat exchange equipment, indirect heat exchangers, etc. It can solve the problems of poor stable operation effect at low power, etc., to broaden the scope of power application and reduce flow resistance. , the effect of reducing power requirements

Pending Publication Date: 2019-06-21
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Bubble migration speed is affected by gravity and wall flow resistance. Therefore, a high liquid filling rate two-phase loop thermosiphon requires a certain starting power to achieve stable circulation operation, and the stable operation effect of low power is poor.

Method used

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  • High-filling-ratio loop thermosiphon based on multi-scale synergistic hydrophobic surface
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  • High-filling-ratio loop thermosiphon based on multi-scale synergistic hydrophobic surface

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Embodiment Construction

[0022] The specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings and technical solutions.

[0023] Such as figure 1 As shown, for the loop thermosiphon with high liquid filling rate, before heating and when the pipeline is not full, there is a certain gas phase zone 3 at the top of the pipeline. After heating in heating zone 1, the liquid near heating zone 1 The phase change of the heat transfer working medium 6 produces bubbles 2. Under the action of the density difference, the bubbles 2 move upwards and squeeze the gas in the gas phase region 3 at the top. The thermal working medium 6 moves to generate a circulation velocity in the pipeline, so that there are two heat transfer modes of liquid convection and liquid phase evaporation and boiling in the heating zone 1. Since the liquid heat transfer medium 6 is not easy to be compressed, when the bubble 2 is generated, the corresponding gas phase ...

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Abstract

The invention belongs to the technical field of energy saving, and relates to a high-filling-ratio loop thermosiphon based on the multi-scale synergistic hydrophobic surface. The high-filling-ratio loop thermosiphon can be used for cooling a high-temperature part under the complex working condition; according to the high-filling-ratio loop thermosiphon based on the multi-scale synergistic hydrophobic surface, besides a heating area and a cooling area, other pipelines are multi-scale synergistic hydrophobic surface heat transfer pipelines; and the heating area on the high-filling-ratio loop thermosiphon based on the multi-scale synergistic hydrophobic surface is lower than the cooling area on the high-filling-ratio loop thermosiphon based on the multi-scale synergistic hydrophobic surface.The heat transfer coefficient can be increased by 20% or above, flowing resistance can be lowered greatly, and the small-power stable operation effect is improved.

Description

technical field [0001] The invention belongs to the technical field of energy saving, and relates to a loop thermosiphon with a high liquid filling rate based on a multi-scale synergistic hydrophobic surface, which can be used for cooling high-temperature components (such as high-power chips, LEDs, solar collectors, etc.) under complex working conditions . Background technique [0002] For a two-phase loop thermosiphon with a high liquid filling rate (between 60% and 90%), the heat transfer mode near the heating surface is flow boiling (liquid convection + liquid phase evaporation boiling), so relatively low liquid filling rate heat Siphon tube (pool boiling phase transfer heat), the heat transfer coefficient is much higher, and can achieve high heat flux heat transfer (greater than 10W / cm 2 ), which is suitable for heat transfer in small heating area and high heat flux density conditions, and is an effective way to solve the heat dissipation problem of small space and larg...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28F13/18F28F21/08
Inventor 胡成志唐大伟白敏丽冯博洋高栋栋
Owner DALIAN UNIV OF TECH
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