Double-sided metal mesh conductive particle and key with same

Abstract

The invention relates to the technical field of conductive particles, and particularly discloses a double-sided metal mesh conductive particle and a key with the same. The double-sided metal mesh conductive particle comprises a first metal mesh layer, a first bonding layer, a substrate layer, a second bonding layer and a second metal mesh layer which are sequentially arranged from top to bottom, wherein a plurality of first conductive bumps are arranged on the upper surface of the first metal mesh layer, and a plurality of second conductive bumps are arranged on the lower surface of the secondmetal mesh layer. According to the double-sided metal mesh conductive particle, reliable contact with a circuit can be ensured, the conductivity is high, and the double-sided conduction function is achieved; when the conductive particles are assembled on an electrical contact point function key, the double-sided conduction can be realized, and influence to the conductivity caused by staggered direction of the conducive particles can be prevented, so that the assembling efficiency and the product yield of the key are greatly improved, the production cost is low, the service life is long, and the practicability is high.

Description

technical field [0001] The invention relates to the technical field of conductive particles, and in particular discloses a double-sided metal mesh conductive particle and a key with the double-sided metal mesh conductive particle. Background technique [0002] With the development of society and the progress of science and technology, the function keys of electrical contact points have been widely used in industrial production and people's daily life. At present, on the function keys of electrical contact points of products such as automobiles, mobile phones, computers, and medical equipment, conductive particles need to be used as conductive functional parts. Conductive particles generally include a base adhesive layer and a metal contact surface connected to the base adhesive layer. [0003] However, the existing conductive particles usually have the following problems: 1. The most traditional conductive particle material is a combination of carbon powder, nickel powder o...

AI Technical Summary

Problems solved by technology

[0003] However, the existing conductive particles usually have the following problems: 1. The most traditional conductive particle material is a combination of carbon powder, nickel powder or nickel foam sheet and silica gel. Its cost is slightly lower, but its electrical resistivity is high. In order to improve For conductivity, we have to reduce the ratio of silica gel and increase the ratio of conductive materials, but after long-term contact and friction, it is easy to drop powder, and the dropped carbon powder is easy to burn the PCB board, resulting in poor life.

2. During the production process, the rubber material is easy to flow out of the glue, so that the non-conductive matrix adhesive layer is higher than the metal contact surface or the metal contact surface is trapped in the matrix adhesive layer, forming a non-conductive abnormality between the button and the PCB board. lead to poor electrical conductivity

3. In order to improve the above shortcomings, flat gold particles or gold-plated conductive particles appeared one after another, but their cost is high, and most of them have metal contact surfaces on one side, which cannot conduct electricity on both sides. When the conductive particles are assembled on electrical contacts When clicking the function button, the front and back sides need to be manually identified, which has the problems of low production efficiency and high cost, and it is easy to appear the situation that the conductive particles are reversed, which affects the product yield and reliability

4. The metal contact surface of the conductive particles on the metal plane is flat and has no concave-convex structure, and cannot form point contact with the circuit. When there is dust or dirt on the contact surface, poor contact will easily cause the circuit to fail to conduct

Images