Conductive silver adhesive for shear-resistant composite LED packaging

A technology of LED packaging and conductive silver glue, which is applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems that the conductivity and mechanical properties cannot be further improved, and achieve the improvement of mechanical properties, electrical conductivity, and interface bonding. Effect

Inactive Publication Date: 2019-06-25
刘凡领
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem mainly solved by the present invention is: aiming at the problem that the conductivity and mechanical properties of the traditional anti-shear composite LED packaging conductive silver glue can not be further improved, a conductive silver glue for anti-shear composite LED packaging is provided

Method used

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  • Conductive silver adhesive for shear-resistant composite LED packaging

Examples

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Effect test

example 1

[0034] In parts by weight, put 30 parts of wood flour, 3 parts of biogas slurry, 5 parts of carbomer 941, 2 parts of sucrose, and 30 parts of water in a fermentation tank at a temperature of 35°C and a speed of 200r / min. , stirred and mixed and fermented for 5 days, then dripped ammonia water with a mass fraction of 30% in the fermentation tank to adjust the pH to 8.3 to obtain a fermentation mixture, then freeze-thawed the fermentation mixture for 8 times, and then passed through the freeze-thaw cycle. Filtrate the fermentation mixture to obtain a filter cake, then wash the filter cake 8 times with deionized water, then place the washed filter cake in an oven, and dry at a temperature of 110°C to a constant weight to obtain a dry filter cake, then place the dry filter cake in a tube furnace, then fill the furnace with nitrogen gas at a rate of 90mL / min, and carbonize 3g of the filter cake at a temperature of 850°C. Cool down to room temperature to obtain the modified additive...

example 2

[0036] Place the sepiolite in a ball mill and pass through a 120-mesh sieve to obtain the ball abrasive, then place the ball abrasive in a muffle furnace, and roast the sepiolite for 3 hours at a temperature of 650°C to obtain pretreated sepiolite, by weight In terms of parts, 30 parts of pretreated sepiolite, 20 parts of low melting point alloy, and 3 parts of ferric oxide are placed in a ball mill and mixed for ball milling for 60 minutes to obtain modified sepiolite; in terms of parts by weight, 60 parts of Epoxy resin, 60 parts of diluent, 8 parts of curing agent, 5 parts of accelerator, 30 parts of compound silver powder and 10 parts of modified sepiolite, 3 parts of plant essential oil and 3 parts of shell powder are placed in the mixer, and the Under the condition of rotating speed of 800r / min, stir and mix for 60min to obtain the conductive silver paste for anti-shear composite LED packaging. The epoxy resin is bisphenol A liquid epoxy resin. The diluent is xylene. T...

example 3

[0038] In parts by weight, put 30 parts of wood flour, 3 parts of biogas slurry, 5 parts of carbomer 941, 2 parts of sucrose, and 30 parts of water in a fermentation tank at a temperature of 35°C and a speed of 200r / min. , stirred and mixed and fermented for 5 days, then dripped ammonia water with a mass fraction of 30% in the fermentation tank to adjust the pH to 8.3 to obtain a fermentation mixture, then freeze-thawed the fermentation mixture for 8 times, and then passed through the freeze-thaw cycle. Filtrate the fermentation mixture to obtain a filter cake, then wash the filter cake 8 times with deionized water, then place the washed filter cake in an oven, and dry at a temperature of 110°C to a constant weight to obtain a dry filter cake, then place the dry filter cake in a tube furnace, then fill the furnace with nitrogen gas at a rate of 90mL / min, and carbonize 3g of the filter cake at a temperature of 850°C. Cool down to room temperature to obtain the modified additive...

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Abstract

The invention discloses a conductive silver adhesive for shear-resistant composite LED packaging, and belongs to the technical field of photoelectric materials. According to the invention, 20 to 30 parts by weight of wood flour, 2 to 3 parts by weight of biogas slurry, 3 to 5 parts by weight of carbomer 941, 1 to 2 parts by weight of sucrose and 20 to 30 parts by weight of water are mixed and fermented, then ammonia water is dripped to adjust the pH value to 8.1 to 8.3, freeze-thaw cycles are carried out for 5 to 8 times, filtration, washing, drying and carbonization are carried out to obtaina modified additive; by ball milling, sieving and roasting of sepiolite, pretreated sepiolite is obtained, 20-30 parts of the pretreated sepiolite, 10-20 parts of a low melting point alloy and 2-3 parts of ferroferric oxide are mixed for ball milling to obtain modified sepiolite; and epoxy resin, a diluent, a curing agent, an accelerator, the modified additive, compounded silver powder, the modified sepiolite, plant essential oil and shell powder are stirred and mixed to obtain the conductive silver adhesive for shear-resistant composite LED packaging. The conductive silver adhesive for shear-resistant composite LED packaging has the characteristics of excellent conductive property and mechanical property.

Description

technical field [0001] The invention discloses a conductive silver glue for anti-shear composite LED packaging, which belongs to the technical field of photoelectric materials. Background technique [0002] LED (Light Emitting Diode) is a semiconductor component that can directly convert electrical energy into light energy. With the continuous development and application of new technologies, LED is characterized by its high efficiency, energy saving and environmental protection, small size, rich colors, and strong light source direction. , cheap, long service life and widely used in display, general lighting, lighting decoration and other fields. In recent years, my country's LED industry has developed rapidly and has become an important LED light source production base in the world. Therefore, one of the key materials for LED packaging, conductive silver glue for LED die bonding, has also attracted more and more attention from related industries. Conductive silver glue for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/08C09J11/04H01L33/56
Inventor 刘凡领
Owner 刘凡领
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