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PCB and manufacturing method thereof

A technology of PCB board and manufacturing method, which is applied in the direction of multilayer circuit manufacturing, printed circuit components, etc.

Inactive Publication Date: 2019-06-25
东莞文殊电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a contradiction between heat dissipation and integration of the prior art PCB board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The present invention will be described in detail below.

[0012] In order to achieve the above object, a PCB board of the present invention includes a heat dissipation substrate, a first circuit layer, a second circuit layer and a third circuit layer arranged on the heat dissipation substrate in sequence, and a circuit layer is arranged between each adjacent circuit layer. There is an insulating medium layer that can dissipate heat, and each circuit layer is electrically connected to other circuit layers through a conductive and heat-conducting connector. The third circuit layer is provided with an outer circuit, and the outer circuit is connected to the first The three circuit layers are electrically connected.

[0013] The heat dissipation substrate in this embodiment includes a ceramic substrate, a seed layer located on the ceramic substrate, a buffer material layer formed on the seed layer, and a copper circuit layer located on the buffer material layer, wherein th...

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Abstract

The invention relates to the technical field of PCB manufacturing and production, in particular to a PCB and a manufacturing method thereof. The PCB includes a heat dissipation substrate, and a firstcircuit layer, a second circuit layer and a third circuit layer arranged in turn on the heat dissipation substrate. A heat dissipation insulating dielectric layer is arranged between every two adjacent circuit layers. Each circuit layer is electrically connected with the other circuit layers through electricity conduction and heat conduction connectors. The third circuit layer is provided with anouter line which is electrically connected with the third circuit layer through a connector. The heat dissipation substrate and the insulating dielectric layer of the PCB have both the functions of insulation and heat dissipation, and the connectors have the functions of electricity conduction and heat conduction. Each circuit layer is electrically connected with the other circuit layers through connectors, and a smooth heat dissipation channel is formed. Therefore, the PCB has a better heat dissipation effect, which is conducive to high integration of electronic products.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing and production, in particular to a PCB board and a manufacturing method thereof. Background technique [0002] The Chinese name of PCB is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. At present, the development trend of electronic products is high performance and miniaturization, which puts forward corresponding requirements for the PCB board as the support body of electronic components, requiring the PCB board to be as small as possible in size and high in integration. At the same time, as the functions of electronic components loaded with chips increase, the power of the chips increases, and more and more heat is generated on the PCB. If...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46
Inventor 黎剑锋
Owner 东莞文殊电子科技有限公司
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