Wafer edge polishing device and method
A polishing device and edge technology, used in grinding/polishing safety devices, grinding/polishing equipment, machine tools suitable for grinding workpiece edges, etc. Improved cleaning effect
Active Publication Date: 2021-06-22
SUMCO CORP
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- Description
- Claims
- Application Information
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Problems solved by technology
As mentioned above, in the case of performing edge polishing after double-side polishing, there is only a single-side polishing process for polishing the wafer surface after the edge polishing process, and there is no opportunity to improve the quality of the wafer backside. Therefore, in the edge polishing process Damage defects on the backside of the wafer that occur in the
Method used
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Effect test
Embodiment
[0070] The presence or absence of the cleaning process of the chuck table was evaluated for its influence on the quality of the back surface of the wafer after edge polishing. As the wafer to be processed, a 450 mm silicon wafer obtained by sequentially performing peripheral grinding, slicing, grinding, etching, and double-sided polishing on a single crystal silicon ingot produced by the CZ method was used.
[0071] In the evaluation test, use figure 1 The edge polishing apparatus shown performs the edge polishing process for 300 wafers in advance, then performs the cleaning process of the chuck table, and further continuously performs the edge polishing process for 5 wafers for evaluation. The edge polishing process of the wafer was alternately repeated five times each, and 25 Example samples of the wafer for evaluation were obtained.
[0072] The cleaning conditions of the chuck table are set as: the rotation speed of the wafer is 200 rpm, the rotation direction of the wafe...
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Abstract
A technical problem of the present invention is to provide an edge polishing device including a cleaning mechanism having a high cleaning effect on slurry residue adhering to a chuck table. The solution is: the edge polishing device (1) has: a chuck table (10), which absorbs and holds the wafer (W); a rotary drive mechanism rotates the chuck table (10); an edge polishing unit (20) The slurry is supplied to the rotating wafer (W) held by the chuck table (10) to polish the edge of the wafer; and the cleaning unit (50) removes the slurry residue on the chuck table (10) . The cleaning unit (50) includes a cleaning head (52), and the cleaning head (52) is equipped with a high-pressure spray nozzle and a brush surrounding the high-pressure spray nozzle, and the chuck table (10) is subjected to high-pressure cleaning using the cleaning head (52). Brush cleaning is performed at the same time as cleaning.
Description
technical field [0001] The invention relates to a wafer edge polishing device and method, in particular to a cleaning mechanism for a chuck table that adsorbs and holds the backside of the wafer during polishing. Background technique [0002] Silicon wafers are widely used as substrate materials for semiconductor devices. The silicon wafer is produced by sequentially performing processes such as peripheral grinding, slicing, lapping, etching, double-sided polishing, single-sided polishing, and cleaning on a single-crystal silicon ingot. Especially recently, in order to obtain a state in which there is no damage defect on the edges of the wafer except for the front and back surfaces of the wafer, it has become mainstream to perform edge polishing after polishing both sides of the wafer. Patent Document 1 describes a buffing device for the outer peripheral portion of a workpiece capable of buffing the end surfaces and outer peripheral surfaces of both the front and rear surfa...
Claims
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IPC IPC(8): B24B55/06B24B9/00H01L21/304
CPCB24B9/00B24B55/06H01L21/304B24B9/065H01L21/6838H01L21/67046H01L21/67051B24B37/27H01L21/67028H01L21/67219
Inventor 安藤慎泉龙典谷本龙一松永祐平山田康生
Owner SUMCO CORP