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Automatic tin sucker, automatic tin suction device and method thereof

An automatic, soldering technology, applied in auxiliary devices, welding equipment, manufacturing tools, etc., can solve the problems of easy splashing, easy splashing on the camera module connector, low efficiency, etc.

Active Publication Date: 2019-06-28
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] First, before disassembling the voice coil motor of the bad module, it is necessary to remove the solder between the pins and the pads. The existing soldering iron method is to remove tin, but due to the large size of the soldering iron, the solder around the pins The space is small, and the surrounding plastic components will be damaged, which will easily lead to damage to the voice coil motor of the bad module
[0005] Second, the current de-soldering method still uses manual de-soldering, and usually the voice coil motor of a bad module has multiple pins, and manual de-soldering can only remove the solder between the pins and the pads one by one. Low efficiency, wasting a lot of labor cost and time cost
[0006] Third, it is difficult to remove tin in a small space, and the removal of solder by the existing tin blowing method will also cause tin slag to splash, which is easy to splash into the eyes of the operator, causing injury to the operator, and easy to splash into the eyes of the operator. There is no picture on the camera module connector
[0007] Fourth, in addition to this, manual operation, in addition to low efficiency, may also cause damage to the voice coil motor due to human factors, resulting in waste of materials and economic losses

Method used

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  • Automatic tin sucker, automatic tin suction device and method thereof
  • Automatic tin sucker, automatic tin suction device and method thereof
  • Automatic tin sucker, automatic tin suction device and method thereof

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Embodiment Construction

[0031] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0032] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

The invention discloses an automatic tin suction device. The automatic tin suction device comprises a supporting frame and an automatic tin sucker mounted on the supporting frame, wherein the automatic tin sucker is provided with a heating system, a storage device and a vacuum suction system; the heating system is used for heating and melting solder of a motor pin into welding slag; and the vacuumsuction system is used for sucking the welding slag away and storing the welding slag in the storage device. The heating system and the vacuum suction system are alternately used, so that the soldering tin on the motor pin is capable of being automatically removed while the economic cost is saved.

Description

technical field [0001] The invention relates to a tin absorber, in particular to an automatic tin absorber and an automatic tin absorber. Background technique [0002] At present, mobile phones are becoming thinner and thinner. As an indispensable camera module on mobile phones, it is bound to match the thickness of the mobile phone, resulting in smaller and smaller storage space reserved for the camera module. Therefore, the camera module It has to be thinner and thinner. As a result, the size of the motor is getting smaller and smaller, and the pins of the motor are getting shorter and shorter, which also leads to a smaller and smaller solder space between the pins and the pad. [0003] In the production process of camera modules, a certain proportion of bad modules will be caused due to various process reasons, material reasons or human reasons. Since the cost of the voice coil motor (VCM) is relatively high, the voice coil motor on the module can be removed and reused ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K1/018
Inventor 吕贵宝陈涌勇朱小盛
Owner NINGBO SUNNY OPOTECH CO LTD
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