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A technology of curing glue and ultraviolet light, which is applied in the direction of film/sheet adhesives, adhesives, epoxy resin glue, etc., can solve the problems of slow curing speed and the influence of semiconductor stress, and achieve high bonding strength and easy to obtain The effect of suitable preparation and surface resistance
Inactive Publication Date: 2019-07-05
SAE TECH DELEVOPMENT DONGGUAN
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However, it should be noted that UV curing adhesives in the semiconductor field have special performance requirements, such as bonding strength, surface resistance, electrostatic voltage, curing speed, etc. For example, if the curing speed is too fast, it will affect the stress of the semiconductor
If the curing speed is slow, it will affect the working ability of the process
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[0013] The ultraviolet curable adhesive film of the present invention will be further described below in conjunction with the examples, but the present invention is not limited thereby.
[0014] Such as figure 1 As shown, the UV-curable adhesive film of the present invention includes a base film 101 , a UV-curable adhesive 102 formed on the base film 101 and a removable film 103 formed on the UV-curable adhesive 102 . Specifically, the thickness of the base film 101 is 160-190 μm, the thickness of the ultraviolet curable adhesive 102 is 2-5 μm, and the thickness of the removable film 103 is 30-50 μm. After the removable film 103 is removed, the UV-curable adhesive 102 and the base film 101 can be cured on the semiconductor by irradiating ultraviolet light.
[0015] Specifically, the components of the UV-curable adhesive are as follows: epoxy resin A 12-15%; epoxy acrylate 10-15%; epoxy resin B 21-35%; diluent 15-25%; free radical initiator 3-8%; cationic initiator 3-8%. Nan...
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Abstract
The invention relates to an ultraviolet curable adhesive film, which comprises: a base film, an ultraviolet curable adhesive formed on the base film and a removable film formed on the ultraviolet curable adhesive. The ultraviolet curable adhesive comprises the following components by mass percentage: 12-15% of epoxy resin A, 10-15% of epoxy acrylate, 21-35% of epoxy resin B, 15-25% of a diluent, 3-8% of a free radical initiator, 3-8% of a cationic initiator, 1-4% of nano-styrene-butadiene rubber, 5-10% of alpha-methyl styrene, and 1-5% of phenol. The ultraviolet curable adhesive film providedby the invention has novel materials and components, and excellent application performance and application indexes, and is suitable for industrial promotion and application.
Description
technical field [0001] The invention relates to the field of semiconductor bonding, in particular to an ultraviolet light curing adhesive film used for semiconductor bonding. Background technique [0002] Ultraviolet light curing glue (UV glue), also known as shadowless glue and photosensitive glue, is a type of adhesive that must be cured by ultraviolet light. It can be used as an adhesive or as an adhesive for paints, coatings, inks, etc. Glue used. UV curing adhesives have many advantages, such as fast curing at room temperature, energy saving, long service life, high bonding strength, etc., and can be widely used in medical and health care, aviation, electronic assembly, printing, optical instruments, packaging, national defense and military industries. However, it should be noted that UV curing adhesives in the semiconductor field have special performance requirements, such as bonding strength, surface resistance, electrostatic voltage, curing speed, etc. For example, ...
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