A liquid pump for micro-cooling system

Abstract

The invention belongs to the technical field of heat-sink cooling, and particularly relates to a liquid pump for a micro-cooling system. Pump covers are arranged on pump bodies; energy converters arepressed into body cavities of the pump bodies through body cavity bosses and large seal rings; the energy converters are formed by two piezoelectric vibrators separated through gaskets; the piezoelectric vibrators are formed by bonding substrates and piezoelectric plates; the energy converters, the large seal rings, the pump cover and the pump body form upper and lower pump cavities; the mutuallyserial-connected upper pump cavities and the mutually serial-connected lower pump cavities are connected in parallel; inlet and outlet valves are arranged on the pump covers of the upper pump cavitiesand the pump bodies of the lower pump cavities and are formed by bonding pressing rings, valve plates and valve seats so as to become butterfly valves; at least one piezoelectric vibrator comprises adriver and a sensor; and a power supply outputs a direct-current voltage signal and utilizes sensing voltage generated by the sensor to judge the deformation state of each piezoelectric vibrator, thesensing voltage drives voltage and piezoelectric vibrator deformation direction to reverse when reaching a maximal value, and through alternate reversing of positive and negative drive voltage, reciprocated bending vibration of the piezoelectric vibrators and one-way flow of a fluid are formed.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation and cooling, and in particular relates to a liquid pump for a micro-cooling system. Background technique [0002] In recent years, with the improvement of the integration and miniaturization of electronic products, and the continuous improvement of the operating speed and configuration density of electronic components such as chips and integrated circuits, the internal ventilation performance of electronic equipment is continuously declining, and the development of electronic components The heat is constantly rising, and cooling methods such as traditional fans and external heat sinks can no longer meet the actual needs. The cooling and heat dissipation effect of the internal components of electronic equipment has become a key factor restricting its reliability and operational stability. Based on this, people have successively proposed a variety of new air-cooled and water-cooled devices ...

AI Technical Summary

Problems solved by technology

Due to the limited fluid pressure and fluid circulation capacity formed by the proposed micro fan and micro pumping system, and the unsatisfactory heat dissipation and cooling effect, there are certain limitations in practical application. The pressure is greatly affected by the working conditions. Fluid viscosity, temperature and output pressure affect the resonant frequency of the pump by affecting the system damping. When the resonant frequency of the piezoelectric vibrator under specific working conditions deviates greatly from the set excitation frequency, The output flow and pressure of the pump will drop significantly

Therefore, the output performance of the piezoelectric pump at a fixed frequency is not ideal, and the accuracy of the output flow and pressure calculated according to the set driving voltage and frequency is also low; in addition, most of the existing piezoelectric pumps use cantilever beam type The cut-off valve has poor flatness and cut-off effect, which seriously affects the output flow and pressure of the pump

Images