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Photolithography system and photolithography method

A lithography system and lithography technology, applied in micro-lithography exposure equipment, optics, optomechanical equipment, etc., to achieve flexible lithography systems, improve fault tolerance, and meet the effects of mass production of wafers

Active Publication Date: 2021-12-07
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a lithography system and a lithography method thereof to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option

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  • Photolithography system and photolithography method
  • Photolithography system and photolithography method
  • Photolithography system and photolithography method

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Embodiment Construction

[0051] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0052] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or im...

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PUM

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Abstract

The invention relates to a lithography system and a lithography method thereof. The system includes: at least two production lines, the production line has a plurality of process units for performing lithography processing on wafers; the detection unit is used to detect the work of the process units in the production line state; the control unit is connected with the detection unit, receives the signal of the working state sent by the detection unit, and generates a control signal according to the working state of the process unit in the production line; the scheduling unit is used to transport the wafer from the production line to the adjacent wafer according to the control signal of the control unit on another production line. The method includes: receiving the working state of the process unit in the production line from the detection unit; judging whether the working state of the process unit in the production line is faulty; when the working state of the process unit in the production line is faulty, the control unit generates a first control signal so that the scheduling Cells transport wafers from a production line to another adjacent production line. The lithography system of the present invention is flexible in operation and can satisfy batch wafer generation.

Description

technical field [0001] The invention relates to the technical field of lithography in semiconductor manufacturing process, in particular to a lithography system and a lithography method thereof. Background technique [0002] The photolithography equipment in the prior art is formed into a continuous production line, and the semiconductor wafers are respectively completed in the production line through composite equipment and exposure equipment to complete processes such as coating, exposure and development. When any equipment or component in the lithography equipment fails, the entire lithography equipment production line will no longer be able to continue to work, which will cause the wafers on the entire production line to stagnate and cannot continue to be processed, which will affect the wafer output efficiency. [0003] The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70733
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC
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